H10W 72/011
Apparatus therefor
Official title: {Apparatus therefor}
H10W72/011 (Apparatus therefor) appears on 1,033 US grants and 1,174 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,033
- Published applications
- 1,174
- Assignees
- 386
- Inventors
- 2,447
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 7 | 0 |
| 1990 | 4 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 9 | 0 |
| 1995 | 5 | 0 |
| 1996 | 10 | 0 |
| 1997 | 9 | 0 |
| 1998 | 15 | 0 |
| 1999 | 21 | 0 |
| 2000 | 24 | 0 |
| 2001 | 30 | 17 |
| 2002 | 28 | 23 |
| 2003 | 27 | 29 |
| 2004 | 17 | 29 |
| 2005 | 30 | 38 |
| 2006 | 22 | 38 |
| 2007 | 23 | 47 |
| 2008 | 19 | 50 |
| 2009 | 27 | 49 |
| 2010 | 47 | 42 |
| 2011 | 38 | 48 |
| 2012 | 43 | 60 |
| 2013 | 50 | 45 |
| 2014 | 42 | 37 |
| 2015 | 28 | 54 |
| 2016 | 43 | 53 |
| 2017 | 36 | 36 |
| 2018 | 44 | 53 |
| 2019 | 31 | 50 |
| 2020 | 46 | 53 |
| 2021 | 37 | 58 |
| 2022 | 40 | 46 |
| 2023 | 48 | 60 |
| 2024 | 37 | 54 |
| 2025 | 53 | 59 |
| 2026 | 24 | 46 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Repair of solder bumps29 Sep 2026US 12,746,613 B2Orbotech Ltd.
- Bonding tool, semiconductor device manufacturing method, and semiconductor device1 Sep 2026US 12,727,501 B2Fuji Electric Co., Ltd.
- Ball mounting apparatus with ball attach volume control18 Aug 2026US 12,708,953 B2Texas Instruments Incorporated
- Pick and place method with detecting an event18 Aug 2026US 12,713,956 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Ball grid array assembly using a solder paste mix and method of using a solder paste dip11 Aug 2026US 12,707,987 B1Frontgrade Technologies Inc.
- Pick and place apparatus for detecting an event8 Oct 2026US 2026/0314459 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Apparatus and method for wafer bonding1 Oct 2026US 2026/0305432 A1Tokyo Electron Limited
- Pin control device, pin insertion device, remaining pin removal device, pin insertion method and remaining pin removal method1 Oct 2026US 2026/0305433 A1
- System including at least two different types of flexures17 Sep 2026US 2026/0282986 A1Canon Kabushiki Kaisha
- Die bonding system including alignment and bonding actuators and a method of using the same17 Sep 2026US 2026/0282987 A1Canon Kabushiki Kaisha
Most cited
By later US patents
- Method for forming contact pins for semiconductor dice and interconnects364US 5,495,667 AMicron Technology, Inc. · 1996
- Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices269US 7,749,882 B2Micron Technology, Inc. · 2010
- Vacuum coupled tool apparatus for dry transfer printing semiconductor elements172US 8,261,660 B2Semprius, Inc. · 2012
- Method of making components with solder balls162US 6,165,885 AInternational Business Machines Corporation · 2000
- Method for fabricating semiconductor chip156US 7,767,551 B2Panasonic Corporation · 2010