H10W 72/0116
Apparatus for manufacturing strap connectors
Official title: {Apparatus for manufacturing strap connectors}
H10W72/0116 (Apparatus for manufacturing strap connectors) appears on 30 US grants and 41 published applications in this corpus.
Search patents in H10W- Granted patents
- 30
- Published applications
- 41
- Assignees
- 31
- Inventors
- 99
- Latest grant
- 13 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 0 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 3 |
| 2005 | 1 | 0 |
| 2006 | 1 | 1 |
| 2007 | 1 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 2 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 2 | 3 |
| 2014 | 2 | 3 |
| 2015 | 0 | 0 |
| 2016 | 2 | 1 |
| 2017 | 0 | 1 |
| 2018 | 2 | 2 |
| 2019 | 0 | 1 |
| 2020 | 1 | 1 |
| 2021 | 1 | 5 |
| 2022 | 2 | 3 |
| 2023 | 2 | 0 |
| 2024 | 3 | 6 |
| 2025 | 2 | 3 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device and method of forming clip bond having multiple bond line thicknesses13 Jan 2026US 12,525,567 B2UTAC Headquarters Pte. Ltd.
- Coated wire2 Sep 2025US 12,404,598 B2Heraeus Electronics GmbH & Co. KG
- Methods of forming wire interconnect structures and related wire bonding tools13 May 2025US 12,300,663 B2Kulicke and Soffa Industries, Inc.
- Electrical connection member, electrical connection structure, and method for manufacturing electrical connection member24 Dec 2024US 12,176,315 B2Hitachi Metals, Ltd.
- Methods of forming wire interconnect structures and related wire bonding tools6 Aug 2024US 12,057,431 B2Kulicke and Soffa Industries, Inc.
- Package structure and method for manufacturing the same2 Jul 2026US 2026/0191012 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Methods of forming wire interconnect structures and related wire bonding tools24 Jul 2025US 2025/0239567 A1Kulicke and Soffa Industries, Inc.
- Laser enhanced wire bonding for semiconductor device packages1 May 2025US 2025/0140739 A1Texas Instruments Incorporated
- Wire supply module and wire bonding machine including the same27 Feb 2025US 2025/0066154 A1Samsung Electronics Co., Ltd.
- Pin wire forming method, wire bonding apparatus, and bonding tool14 Nov 2024US 2024/0379613 A1Kabushiki Kaisha Shinkawa
Most cited
By later US patents
- Packaged IC using insulated wire44US 7,138,328 B2Freescale Semiconductor, Inc. · 2006
- Resin coated bonding wire, method of manufacturing the same, and semiconductor device43US 5,396,104 ANippon Steel Corporation · 1995
- Bonding wire, semiconductor device having the same, and bonding method using the same5US 4,488,674 ATokyo Shibaura Denki Kabushiki Kaisha · 1984
- Method for manufacturing microwire and device for effecting same5US 4,545,229 ABelorussky Politekhnichesky Institut · 1985
- Method of wire bonding with applied insulative coating5US 4,678,114 AKabushiki Kaisha Toshiba · 1987