Method of wire bonding with applied insulative coating
AssigneeKabushiki Kaisha Toshiba
InventorsHideharu Egawa, Katsuya Okumura
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Abstract
The invention provides a bonding wire which prevents electric short-circuiting even if it comes into contact with another bonding wire, a bonding method using the same, and a semiconductor device including the same. The bonding wire comprises a core wire made of a metal and an insulating film which surrounds it. The insulating film is eliminated from the ends of the bonding wire by thermal decomposition and scattering, while simultaneously each end of the bonding wire is connected to a bonding pad of the semiconductor device or to a lead frame. In the semiconductor device, the bonding pads are respectively connected to lead frames by means of the bonding wires.
Claims7
A method for connecting a bonding pad to a lead frame of a semiconductor device through a bonding wire, comprising the steps of:
- providing a bonding wire which has a core wire made of a metal and an insulating film which surrounds said core wire, said insulating film being made of a flexible resin which is thermally stable at temperatures below 200.degree. C., and which thermally decomposes and scatters at a temperature of 200.degree. to 300.degree. C.;
- thermally decomposing and scattering one end portion of said insulating film of said bonding wire and thereafter bonding the one end portion of said core wire which is exposed to said bonding pad by a nail head bonding method;
- and
- bonding the other end portion of said core wire to said lead frame.
Dependencies are inferred from the claim text.