Packaged IC using insulated wire
AssigneeFreescale Semiconductor, Inc.
InventorsSusan H. Downey, Peter R. Harper
Life of this patent
Estimating the term…
Abstract
A packaged IC including insulated wire for electrically connecting conductive structures of the packaged IC. In some embodiments, the packaged IC includes an IC die attached to a package substrate, where bond pads of the IC die are electrically connected to bond fingers of the substrate with insulated wire. The insulated wire has a conductive core and an insulator coating. In some examples, the insulator coating includes an inorganic covalently-bonded substance that is not an oxide of the electrically conductive core such as, e.g., silicon nitride or silicon oxide. In one example, the insulator coating is applied to a conductive core by a chemical vapor deposition (CVD) process such as a plasma enhanced chemical vapor deposition (PECVD).
Claims23
A method of making a packaged integrated circuit (IC), comprising:
- providing an IC die having a first conductive structure;
- providing a substrate having a second conductive structure;
- providing a conductive core;
- applying an insulator coating only around the conductive core by a chemical vapor deposition process to form an insulated wire, wherein the insulator coating includes an inorganic covalently-bonded substance that is not an oxide of the conductive core prior to electrically connecting the first conductive structure with the second conductive structure with the insulated wire;
- and
- encapsulating at least a portion of each of the IC die, the first conductive structure, the second conductive structure, and the insulated wire.
A method of making a packaged integrated circuit (IC), comprising:
- providing an IC die having a first conductive structure;
- providing a substrate having a second conductive structure;
- electrically connecting the first conductive structure with the second conductive structure with an insulated wire, wherein the insulated wire is formed by applying an insulator coating only around a conductive core, wherein the insulator coating includes an inorganic covalently-bonded substance that is not an oxide of the conductive core;
- and
- encapsulating at least a portion of each of the IC die, the first conductive structure, the second conductive structure, and the insulated wire.
Dependencies are inferred from the claim text.