Resin coated bonding wire, method of manufacturing the same, and semiconductor device
AssigneeNippon Steel Corporation
InventorMasao Kimura
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Abstract
Disclosed are an insulation film covered bonding wire comprising a conductive metal core wire the circumference of which is coated with an insulation film of an at least one type composed of polymer resin materials selected from a group of aromatic polyesters, polyimides, polyether-ether ketones, polyamides, polysulfones, and liquid crystal polymers, wherein no crack is developed to the insulation film when an impact force of 1 cm.g is applied to the coated wire by a drop weight, a method of manufacturing the bonding wire, and a semiconductor device using the same.
Claims6
An insulation film covered bonding wire, comprising a conductive metal core wire the circumference of which is coated with an insulation film comprised of an at least one polymer resin material selected from a group of aromatic polyesters, polyether-ether ketones, polyamides, polysulfones, and liquid crystal polymers, wherein no crack is developed to said resin material when an impact of 1 cm.g is applied to wire coated with said resin material by a falling weight;
- wherein said insulation film comprised of said polymer resin material has a melt index of 1.0 to 100 g/10 min;
- and,
- wherein said insulation film comprised of said polymer resin material has a thickness of 0.01 to 10 .mu.m.
Dependencies are inferred from the claim text.