Methods of forming wire interconnect structures and related wire bonding tools
AssigneeKulicke and Soffa Industries, Inc.
InventorsBasil Milton, Romeo Olida, Jonathan Geller, Tomer Levinson
Life of this patent
Estimating the term…
Abstract
A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to a position above the wire bond; (c) moving the wire bonding tool to contact the length of wire, at a position along the length of wire, to partially sever the length of wire at the position along the length of wire; and (d) separating the length of wire from a wire supply at the position along the length of wire, thereby providing a wire interconnect structure bonded to the bonding location.
Claims15
A method of forming a wire interconnect structure, the method comprising the steps of:
- (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool;
- (b) extending a length of wire, continuous with the wire bond, to a position above the wire bond;
- (c) moving the wire bonding tool to contact the length of wire while above the wire bond, at a position along the length of wire, such that a pointed edge of a tip portion of the wire bonding tool contacts the length of wire, to partially sever the length of wire at the position along the length of wire;
- and
- (d) separating the length of wire from a wire supply at the position along the length of wire, thereby providing a wire interconnect structure bonded to the bonding location.
A method of forming a wire interconnect structure the method comprising the steps of:
- (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool;
- (b) extending a length of wire, continuous with the wire bond, to a position above the wire bond;
- (c) moving the wire bonding tool to contact the length of wire while above the wire bond, at a position along the length of wire, such that a cutting feature of a tip portion of the wire bonding tool contacts the length of wire, to partially sever the length of wire at the position along the length of wire;
- and
- (d) separating the length of wire from a wire supply at the position along the length of wire, thereby providing a wire interconnect structure bonded to the bonding location.
A method of forming a wire interconnect structure, the method comprising the steps of:
- (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool;
- (b) extending a length of wire, continuous with the wire bond, to a position above the wire bond;
- (c) moving the wire bonding tool to contact the length of wire while above the wire bond, at a position along the length of wire, such that an edge portion adjacent an inner chamfer of the wire bonding tool contacts the length of wire, to partially sever the length of wire at the position along the length of wire;
- and
- (d) separating the length of wire from a wire supply at the position along the length of wire, thereby providing a wire interconnect structure bonded to the bonding location.
Dependencies are inferred from the claim text.