Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
AssigneeMicron Technology, Inc.
InventorsYoung Do Kweon, Tongbi Jiang
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Abstract
Microelectronic devices and method of forming a plurality of microelectronic devices on a semiconductor workpiece are disclosed herein. One such method includes placing a plurality of first interconnect elements on a side of a semiconductor workpiece, forming a layer on the side of the workpiece, reshaping the first interconnect elements by heating the first interconnect elements, and coupling a first portion of a plurality of individual second interconnect elements to corresponding first interconnect elements with a second portion of the individual second interconnect elements exposed.
Claims16
A method of forming a plurality of microelectronic devices on a semiconductor workpiece having a plurality of microelectronic dies, the method comprising:
- attaching a plurality of first solder ball interconnect elements on corresponding terminals of the semiconductor workpiece;
- molding a protective layer onto the workpiece with the layer covering only a portion of individual first solder ball interconnect elements;
- reconfiguring the first solder ball interconnect elements without removing material from the first solder ball interconnect elements, such that a top surface of the plurality of first solder ball interconnect elements located opposite the corresponding terminals is reconfigured to include a flat surface spaced apart from the protective layer;
- and
- after reconfiguring the first solder ball interconnect elements, attaching a plurality of second solder ball interconnect elements on the flat surface of corresponding first solder ball interconnect elements.
A method of forming microelectronic devices on a semiconductor workpiece, comprising:
- attaching first solder ball interconnect elements to terminals of the semiconductor workpiece;
- depositing mold compound onto a surface of the semiconductor workpiece;
- clamping the semiconductor workpiece in a mold, the mold comprising a first mold portion having a compressible release tape configured to contact the mold compound and deform around a portion of the first solder ball interconnect elements, and a second mold portion configured to contact an opposite side of the semiconductor workpiece, wherein clamping the semiconductor workpiece in the mold comprises spreading the mold compound across the surface of the semiconductor workpiece to form a protective layer on the workpiece, and wherein the first solder ball interconnect elements protrude from the protective layer;
- reconfiguring the first solder ball interconnect elements without removing material from the first solder ball elements to have a flat top surface spaced apart from an exposed surface of the protective layer in a different plane;
- after reconfiguring the first solder ball interconnect elements, attaching second solder ball interconnect elements on the flat surface of the first solder ball interconnect elements.
Dependencies are inferred from the claim text.