Method for forming contact pins for semiconductor dice and interconnects

A method for forming a contact pin for an interconnect, said contact pin adapted to establish an electrical connection with a contact location on a semiconductor die, comprising:

• forming a substrate;
• forming a conductive trace on the substrate;
• attaching a metal pin to the substrate in electrical communication with the conductive trace said metal pin formed of a wire that is attached to the substrate using an attachment method selected from the group consisting of wire bonding and welding;
• heating and shaping the wire as it is attached to the substrate to form a compliant spring segment;
• and
• following heating and shaping of the wire severing the wire.

A method for forming a contact pin for an interconnect, said contact pin adapted to establish an electrical connection with a contact location on a semiconductor die, comprising:

• forming a substrate;
• forming a conductive trace on the substrate;
• attaching a metal pin to the substrate in electrical communication with the conductive trace, said metal pin formed of a wire that is wire bonded to the substrate;
• heating and shaping the wire as it is wire bonded to form a compliant spring segment;
• and then
• severing the wire.

A method for forming a contact structure on a semiconductor die, said die including a substrate with integrated circuitry and a die pad in electrical communication with the integrated circuitry, said method comprising:

• forming a solder pad on the die pad;
• attaching a metal wire to the solder pad using a wire bonding process;
• heating and shaping the wire into a compliant structure during said wire bonding process;
• and
• after shaping the wire, severing the wire to form a compliant contact pin on the die pad.

A method for forming a contact structure on a semiconductor die having a plurality of die pads in electrical communication with integrated circuitry formed on the die, said method comprising:

• forming a mask on the substrate having an opening aligned with the die pads;
• forming a shorting layer on the substrate to electrically connect the die pads;
• forming welding pads in the openings in electrical contact with the die pads;
• attaching metal wires to the welding pads using a welding process;
• heating and shaping the metal wires during the welding process into a compliant structure;
• severing the metal wire to form contact pins;
• and
• removing the shorting layer except in an area in contact with the welding pads.