H10W 72/0115
Apparatus for manufacturing bond wires
Official title: {Apparatus for manufacturing bond wires}
H10W72/0115 (Apparatus for manufacturing bond wires) appears on 39 US grants and 51 published applications in this corpus.
Search patents in H10W- Granted patents
- 39
- Published applications
- 51
- Assignees
- 37
- Inventors
- 144
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 0 | 0 |
| 2003 | 1 | 0 |
| 2004 | 0 | 3 |
| 2005 | 1 | 0 |
| 2006 | 1 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 2 |
| 2010 | 1 | 2 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 2 | 1 |
| 2014 | 2 | 3 |
| 2015 | 0 | 2 |
| 2016 | 2 | 3 |
| 2017 | 0 | 1 |
| 2018 | 2 | 2 |
| 2019 | 0 | 2 |
| 2020 | 2 | 1 |
| 2021 | 1 | 4 |
| 2022 | 2 | 1 |
| 2023 | 1 | 6 |
| 2024 | 3 | 10 |
| 2025 | 7 | 3 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bonding tool, semiconductor device manufacturing method, and semiconductor device1 Sep 2026US 12,727,501 B2Fuji Electric Co., Ltd.
- Recording element unit and method for manufacturing recording element unit17 Feb 2026US 12,552,161 B2Canon Kabushiki Kaisha
- Methods of testing bonded wires on wire bonding machines17 Feb 2026US 12,553,937 B2Kulicke and Soffa Industries, Inc.
- AG alloy bonding wire for semiconductor devices and semiconductor device4 Nov 2025US 12,463,172 B2Nippon Micrometal Corporation
- Coated wire2 Sep 2025US 12,404,598 B2Heraeus Electronics GmbH & Co. KG
- Wire guides, wire bonding systems, and related methods4 Jun 2026US 2026/0157211 A1Kulicke and Soffa Industries, Inc.
- Wire bonding apparatus16 Apr 2026US 2026/0107809 A1Samsung Electronics Co., Ltd.
- Methods of forming wire interconnect structures and related wire bonding tools24 Jul 2025US 2025/0239567 A1Kulicke and Soffa Industries, Inc.
- Laser enhanced wire bonding for semiconductor device packages1 May 2025US 2025/0140739 A1Texas Instruments Incorporated
- Wire supply module and wire bonding machine including the same27 Feb 2025US 2025/0066154 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Packaged IC using insulated wire44US 7,138,328 B2Freescale Semiconductor, Inc. · 2006
- Resin coated bonding wire, method of manufacturing the same, and semiconductor device43US 5,396,104 ANippon Steel Corporation · 1995
- Manufacturing method of extra fine wire25US 4,901,550 AMitsubishi Kinzoku Kabushiki Kaisha · 1990
- Process for polymer coating electrical conductors17US 4,497,849 A1985
- Bonding wire, semiconductor device having the same, and bonding method using the same5US 4,488,674 ATokyo Shibaura Denki Kabushiki Kaisha · 1984