Recording element unit and method for manufacturing recording element unit

A method for manufacturing a recording element unit for use in a liquid ejection head, the recording element unit comprising:

• a recording element substrate having an ejection energy generating portion, a flow passage, and an ejection port;
• an electric wiring member having a semiconductor integrated circuit for generating an electric signal for ejecting a liquid from the ejection port;
• a first electrode pad provided at either one of the recording element substrate and the electric wiring member, and a second electrode pad provided on the other;
• and
• a wire having a plurality of bending points, and connected at one end thereof with a first connection point of the first electrode pad, and connected at the other end thereof with a second connection point of the second electrode pad, the wire electrically connecting the first electrode pad and the second electrode pad, and
• wherein the wire includes, in order of proximity to the first connection point in a direction of extension of the wire, a first bending point at a height from the first connection point of at least 100 μm and not more than 200 μm, a second bending point at a horizontal distance from the first bending point of at least 100 μm and not more than 270 μm, and a third bending point provided at a lower position than that of the first bending point, and at a distance of within 150 μm from an intermediate point between the first electrode pad and the second electrode pad in a horizontal direction, the method for manufacturing a recording element unit comprising the steps of:
• connecting one end of the wire to the first connection point;
• sequentially forming the first bending point, the second bending point, and the third bending point of the wire by a capillary operation including four upward movements and three downward and horizontal movements of a capillary from the first connection point;
• and
• connecting the other end of the wire to the second connection point.