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US 12,553,937 B2Granted
Methods of testing bonded wires on wire bonding machines
AssigneeKulicke and Soffa Industries, Inc.
InventorOdal Kwon
Life of this patent
Estimating the term…
Abstract
A method of testing a bonded wire on a wire bonding machine is provided. The method includes the steps of: (a) bonding a portion of a wire to a bonding location using a wire bonding tool on a wire bonding machine to form a bonded portion of the wire; (b) moving the wire bonding tool away from the bonded portion of the wire after step (a) with the wire engaged with the wire bonding tool; and (c) moving the wire bonding tool along a motion profile after step (b), with the wire engaged with the wire bonding tool to test the wire.
Claims19
A method comprising the steps of:
- (a) bonding a portion of a wire to a bonding location using a wire bonding tool on a wire bonding machine to form a bonded portion of the wire;
- (b) moving the wire bonding tool away from the bonded portion of the wire after step (a) with the wire engaged with the wire bonding tool, wherein step (b) includes forming at least a portion of a wire loop shape while moving the wire bonding tool away from the bonded portion;
- (c) moving the wire bonding tool along a motion profile after step (b) with the wire engaged with the wire bonding tool to test the wire by putting stress on the wire, wherein the motion profile includes oscillation in one or more directions, the one or more directions including (i) along an x-axis of the wire bonding machine, (ii) along a y-axis of the wire bonding machine, or (iii) along a direction that a wire loop extends;
- and
- (d) analyzing the wire for damage during at least one of (i) step (c) and (ii) a period of time after step (c).
2 more elements
A method comprising the steps of:
- (a) bonding a portion of a wire to a bonding location using a wire bonding tool on a wire bonding machine to form a bonded portion of the wire;
- (b) forming at least a portion of a wire loop shape while moving the wire bonding tool away from the bonded portion of the wire with the wire engaged with the wire bonding tool after step (a);
- (c) moving the wire bonding tool along a motion profile after step (b) with the wire engaged with the wire bonding tool to test the wire by putting stress on the wire, wherein the motion profile includes oscillation in one or more directions, the one or more directions including (i) along an x-axis of the wire bonding machine, (ii) along a y-axis of the wire bonding machine, or (iii) along a direction that a wire loop extends;
- (d) repeating steps (a)-(c) to generate test data related to the wire loop shape;
- and
- (e) analyzing the wire for damage during at least one of (i) step (c) and (ii) a period of time after step (c).
3 more elements
A method comprising the steps of:
- (a) bonding a portion of a wire to a bonding location using a wire bonding tool on a wire bonding machine to form a bonded portion of the wire;
- (b) forming at least a portion of a wire loop shape while moving the wire bonding tool away from the bonded portion of the wire with the wire engaged with the wire bonding tool after step (a);
- (c) moving the wire bonding tool along a motion profile after step (b) with the wire engaged with the wire bonding tool to test the wire by putting stress on the wire, wherein the motion profile includes oscillation in one or more directions, the one or more directions including (i) along an x-axis of the wire bonding machine, (ii) along a y-axis of the wire bonding machine, or (iii) along a direction that a wire loop extends;
- (d) repeating steps (a)-(c) with the wire loop shape to generate test data related to the wire loop shape;
- (e) repeating steps (a)-(d) for a plurality of additional wire loop shapes, wherein the wire loop shape and the plurality of additional wire loop shapes are included in a plurality of wire loop shapes;
- (f) analyzing the wire for damage during at least one of (i) step (c) and (ii) a period of time after step (c);
- and
- (g) selecting one of the plurality of wire loop shapes based on predetermined criteria to be used in a subsequent wire bonding operation after step (e).
5 more elements
Dependencies are inferred from the claim text.