H10W 72/0112
Apparatus for manufacturing bump connectors
Official title: {Apparatus for manufacturing bump connectors}
H10W72/0112 (Apparatus for manufacturing bump connectors) appears on 416 US grants and 450 published applications in this corpus.
Search patents in H10W- Granted patents
- 416
- Published applications
- 450
- Assignees
- 173
- Inventors
- 896
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 7 | 0 |
| 1997 | 4 | 0 |
| 1998 | 7 | 0 |
| 1999 | 9 | 0 |
| 2000 | 9 | 0 |
| 2001 | 10 | 4 |
| 2002 | 8 | 9 |
| 2003 | 11 | 11 |
| 2004 | 6 | 8 |
| 2005 | 11 | 21 |
| 2006 | 12 | 15 |
| 2007 | 10 | 25 |
| 2008 | 9 | 27 |
| 2009 | 18 | 32 |
| 2010 | 26 | 19 |
| 2011 | 22 | 25 |
| 2012 | 23 | 19 |
| 2013 | 18 | 13 |
| 2014 | 14 | 12 |
| 2015 | 13 | 24 |
| 2016 | 18 | 22 |
| 2017 | 16 | 19 |
| 2018 | 21 | 25 |
| 2019 | 10 | 18 |
| 2020 | 22 | 20 |
| 2021 | 18 | 19 |
| 2022 | 17 | 16 |
| 2023 | 13 | 16 |
| 2024 | 9 | 10 |
| 2025 | 9 | 10 |
| 2026 | 9 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Repair of solder bumps29 Sep 2026US 12,746,613 B2Orbotech Ltd.
- Ball mounting apparatus with ball attach volume control18 Aug 2026US 12,708,953 B2Texas Instruments Incorporated
- Ball grid array assembly using a solder paste mix and method of using a solder paste dip11 Aug 2026US 12,707,987 B1Frontgrade Technologies Inc.
- Method of manufacturing a three-dimensionally integrated structure having a clamping surface and a wafer stack with a chamfered surface4 Aug 2026US 12,701,771 B2Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same21 Apr 2026US 12,610,839 B2Micron Technology, Inc.
- Differential contrast plating for advanced packaging applications3 Sep 2026US 2026/0258571 A1Lam Research Corporation
- Apparatus for preventing oxidation of electronic part6 Aug 2026US 2026/0231803 A1Shibuya Corporation
- Process Chamber with UV Irradiance30 Jul 2026US 2026/0216806 A1Yield Engineering Systems, Inc.
- Imprint mold, method for manufacturing semiconductor device using the same, and semiconductor device2 Jul 2026US 2026/0191066 A1Panasonic Intellectual Property Management Co., Ltd.
- Laser-assisted reflow for selective heating used with a low temperature tray2 Jul 2026US 2026/0191068 A1Intel Corporation
Most cited
By later US patents
- Method for forming contact pins for semiconductor dice and interconnects364US 5,495,667 AMicron Technology, Inc. · 1996
- Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices269US 7,749,882 B2Micron Technology, Inc. · 2010
- Method of making components with solder balls162US 6,165,885 AInternational Business Machines Corporation · 2000
- Method and apparatus for solder sphere placement using an air knife146US 5,431,332 AMotorola, Inc. · 1995
- Method of bumping substrates by contained paste deposition146US 5,539,153 AHewlett-Packard Company · 1996