Apparatus for preventing oxidation of electronic part

An apparatus for preventing oxidation of an electronic part, the apparatus including a plasma irradiation unit configured to irradiate a bump formed on a bonding surface of the electronic part with plasma to remove an oxide film formed on the bump, the apparatus comprising:

• a holding head including a holding surface configured to hold the electronic part on a surface opposite to a bonding surface, and a spray port formed at a position adjacent to the electronic part held by the holding surface;
• a gas supply unit configured to spray inert gas from the spray port;
• and
• a moving unit configured to move the holding head from a reception position to a transfer position of the electronic part, wherein
• an irradiation portion of the plasma irradiation unit is provided between the reception position and the transfer position, and a facing surface facing an entire bonding surface of the electronic part held by the moving holding head is provided continuously from the irradiation portion to the transfer position,
• the holding head includes the spray port at least on a front side in a moving direction toward the transfer position,
• the moving unit moves the holding head holding the electronic part at the reception position, from the irradiation portion to the transfer position in a state where the bump of the held electronic part and the facing surface are brought close to each other, and
• the gas supply unit continuously sprays inert gas from the spray port during a period from a time when plasma is emitted from the irradiation portion until the electronic part is moved to the transfer position.