Die bonding system including alignment and bonding actuators and a method of using the same

A die bonding system, comprising:

• a frame;
• a movable platform adapted to retain a die chuck;
• a set of bonding actuators;
• a set of bonding flexures, wherein each of the bonding flexures has a corresponding bonding actuator, and each pair of a bonding flexure and its corresponding bonding actuator is operably coupled to the frame and the movable platform;
• a set of alignment actuators;
• and
• a set of alignment flexures, wherein each of the alignment flexures has a corresponding alignment actuator, and each pair of an alignment flexure and its corresponding alignment actuator is operably coupled to the frame and the movable platform,
• wherein the die bonding system has an adjustment cycle frequency of at least 50 Hz, wherein the adjustment cycle frequency corresponds to a start time when a signal corresponding to a position of the movable platform is processed begins for a current adjustment cycle until an end time when adjusting the movable platform from a prior orientation to a new orientation is completed, wherein adjusting is performed in response to processing the signal during the current adjustment cycle.

A method, comprising:

• coupling a first die to a first die chuck of a die bonding system, wherein the die bonding system includes a first bonding head that includes:
• a first frame;
• the first die chuck;
• a first movable platform that retains the first die chuck;
• a first set of first bonding actuators operably coupled to the first frame and the first movable platform;
• and
• a first set of first alignment actuators operably coupled to the first frame and the first movable platform,
• wherein each first bonding actuator is adapted to apply a first bonding force to the first movable platform in a first direction parallel to and offset from a first central axis passing through a center of the first movable platform, and
• wherein each first alignment actuator is adapted to apply a first alignment force to the first movable platform along a first alignment force plane that is orthogonal to the first central axis,
• coupling a second die to a second die chuck of the die bonding system, wherein the die bonding system further includes a second bonding head that is spaced apart from the first bonding head and includes:
• a second frame;
• the second die chuck;
• a second movable platform that retains the die second chuck;
• a second set of second bonding actuators operably coupled to the second frame and the second movable platform;
• and
• a second set of second alignment actuators operably coupled to the second frame and the second movable platform,
• wherein each second bonding actuator is adapted to apply a second bonding force to the second movable platform in a second direction parallel to and offset from a second central axis passing through a center of the second movable platform, and
• wherein each second alignment actuator is adapted to apply a second alignment force to the second movable platform along a second alignment force plane that is orthogonal to the second central axis passing;
• adjusting the first movable platform to a first adjusted orientation, wherein adjusting the first movable platform is performed using at least one actuator from any one or more actuators within the first set of first bonding actuators and the first set of first alignment actuators;
• adjusting the second movable platform to a second adjusted orientation, wherein adjusting the second movable platform is performed using at least one actuator from any one or more actuators within the second set of second bonding actuators and the second set of second alignment actuators;
• bonding the first die to a first die bonding site of a substrate, wherein bonding the first die includes activating the first set of first bonding actuators;
• and
• bonding the second die to a second die bonding site of the substrate, wherein bonding the second die includes activating the second set of second bonding actuators,
• wherein the first die bonding site is spaced apart from the second die bonding site, and bonding the first die and bonding the second die are performed simultaneously during at least a same point in time.