H10W 72/0113
Apparatus for manufacturing die-attach connectors
Official title: {Apparatus for manufacturing die-attach connectors}
H10W72/0113 (Apparatus for manufacturing die-attach connectors) appears on 422 US grants and 436 published applications in this corpus.
Search patents in H10W- Granted patents
- 422
- Published applications
- 436
- Assignees
- 194
- Inventors
- 964
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 6 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 4 | 0 |
| 1998 | 7 | 0 |
| 1999 | 11 | 0 |
| 2000 | 13 | 0 |
| 2001 | 19 | 12 |
| 2002 | 18 | 13 |
| 2003 | 14 | 16 |
| 2004 | 11 | 17 |
| 2005 | 16 | 16 |
| 2006 | 9 | 22 |
| 2007 | 10 | 19 |
| 2008 | 9 | 22 |
| 2009 | 8 | 14 |
| 2010 | 19 | 21 |
| 2011 | 16 | 19 |
| 2012 | 19 | 36 |
| 2013 | 25 | 26 |
| 2014 | 24 | 20 |
| 2015 | 13 | 20 |
| 2016 | 19 | 27 |
| 2017 | 18 | 12 |
| 2018 | 16 | 15 |
| 2019 | 10 | 14 |
| 2020 | 11 | 13 |
| 2021 | 10 | 16 |
| 2022 | 8 | 10 |
| 2023 | 15 | 12 |
| 2024 | 8 | 12 |
| 2025 | 8 | 7 |
| 2026 | 3 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device and method for manufacturing the semiconductor device28 Jul 2026US 12,696,825 B2Denso Corporation
- IC chip mounting device, and IC chip mounting method24 Mar 2026US 12,588,532 B2Kabushiki Kaisha Sato
- Copper paste for joining, method for manufacturing joined body, and joined body3 Mar 2026US 12,564,879 B2Resonac Corporation
- Manufacturing apparatus of semiconductor device and manufacturing method of semiconductor device18 Nov 2025US 12,475,551 B2Yamaha Robotics Co., Ltd.
- Thermal conduction sheet holder and method of manufacturing heat dissipating device14 Oct 2025US 12,441,576 B2Resonac Corporation
- Molding apparatus, planarization apparatus, molding method, and article manufacturing method28 May 2026US 2026/0150743 A1Canon Kabushiki Kaisha
- Method of joining electrical and mechanical components using laminated modular preforms30 Apr 2026US 2026/0123502 A1Alpha Assembly Solutions Inc.
- Thermal conduction sheet holder and method of manufacturing heat dissipating device8 Jan 2026US 2026/0008645 A1Resonac Corporation
- Liquid coating method and liquid coating device1 Jan 2026US 2026/0001097 A1Musashi Engineering, Inc.
- Semiconductor manufacturing system and method1 Jan 2026US 2026/0005186 A1Intel Corporation
Most cited
By later US patents
- Method for fabricating semiconductor chip156US 7,767,551 B2Panasonic Corporation · 2010
- Process for dispensing semiconductor die-bond adhesive using a printhead having a microjet array and the product produced by the process129US 5,681,757 AMicroFab Technologies, Inc. · 1997
- Lead-on-chip semiconductor device package having an adhesive layer formed from liquid adhesive and method for manufacturing the same116US 5,897,339 ASamsung Electronics Co., Ltd. · 1999
- Semiconductor wafer treatment method112US 7,468,309 B2Disco Corporation · 2008
- Void-free underfill of surface mounted chips82US 6,048,656 AMicron Technology, Inc. · 2000