Semiconductor wafer treatment method
AssigneeDisco Corporation
InventorsKoichi Shigematsu, Toshiyuki Yoshikawa
Life of this patent
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Abstract
A semiconductor wafer treatment method for dividing an adhesive tape, which has been stuck to the entire back of a semiconductor wafer, along divided streets of the semiconductor wafer. Before division of the adhesive tape by application of laser beams, the state of the divided streets is detected, and laser beams are applied to the adhesive tape based on such detection.
Claims4
A semiconductor wafer treatment method for a semiconductor wafer having a plurality of rectangular regions partitioned on a face of the wafer by streets arranged in a lattice pattern on the face, comprising dividing the wafer along the streets, sticking an adhesive tape to an entire back of the wafer, and then dividing the adhesive tape along the streets which have been divided,
- the semiconductor wafer treatment method further comprising:
- detecting a state of the divided streets before dividing the adhesive tape along the divided streets wherein the detection of the state of the divided streets involves detecting, on the divided streets, xy-coordinate positions of at least 3 points spaced from each other in an extending direction of the streets;
- and
- performing division of the adhesive tape by applying laser beams to the adhesive tape based on detection of the state of the divided streets.
Dependencies are inferred from the claim text.