Lead-on-chip semiconductor device package having an adhesive layer formed from liquid adhesive and method for manufacturing the same

A method for manufacturing a lead-on-chip semiconductor device package, comprising steps of:

• preparing a semiconductor chip and a lead frame, said semiconductor chip having an active surface on which a plurality of electrode pads are formed, and said lead frame having a plurality of inner leads and a plurality of outer leads;
• applying a liquid adhesive to said plurality of inner leads of said lead frame to form an adhesive layer, wherein said liquid adhesive is continuously applied to both a surface of said plurality of inner leads and spaces between adjacent of said plurality of inner leads;
• attaching said plurality of inner leads of said lead frame to said active surface of said semiconductor chip using said adhesive layer, said adhesive layer being positioned between said semiconductor chip and said lead frame, such that said plurality of inner leads of said lead frame are placed over said active surface of said semiconductor chip and said plurality of electrode pads of said semiconductor chip are exposed between opposing rows of said plurality of inner leads;
• electrically interconnecting said respective ones of said electrode pads to corresponding ones of said lead frame using a bonding wire;
• and
• encapsulating said semiconductor chip, said adhesive layer, said plurality of inner leads of said lead frame, and said plurality of bonding wires, with an encapsulant.