Pick and place apparatus for detecting an event
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorJEN-YUAN CHANG
Life of this patent
Estimating the term…
Abstract
A pick and place method includes providing at least one semiconductor element disposed on a source storage location, picking up the at least one semiconductor element from the source storage location, transferring the at least one semiconductor element to a temporary storage device according to a signal, positioning the at least one semiconductor element via the temporary storage device, and picking up the positioned semiconductor element from the temporary storage device and placing the positioned semiconductor element on a destination storage location.
Claims20
A pick and place apparatus, comprising:
- a source storage location configured to store at least one semiconductor element;
- a destination storage location configured to receive the at least one semiconductor element;
- a temporary storage device configured to position the at least one semiconductor element, wherein the temporary storage device includes a platform having a top surface and a cavity recessed from the top surface, the cavity having a bottom surface, and the top surface of the platform is configured to support an edge of a bottom surface of the at least one semiconductor element such that the bottom surface of the at least one semiconductor element extends across the cavity and is spaced apart from the bottom surface of the cavity;
- a controller configured to send a signal after detecting an event;
- and
- a picked-up head configured to pick and place the at least one semiconductor element and transferring the at least one semiconductor element to the temporary storage device according to the signal sent by the controller.
A pick and place apparatus, comprising:
- a platform having a top surface and a cavity recessed from the top surface, the cavity having a bottom surface, the platform being configured to place at least one semiconductor element thereon such that an edge of a bottom surface of the at least one semiconductor element is disposed on the top surface of the platform, the bottom surface of the at least one semiconductor element extends across the cavity, and the bottom surface of the at least one semiconductor element is spaced apart from the bottom surface of the cavity by at least a depth of the cavity;
- and
- at least one optical detector disposed below the platform and configured to detect a position of the at least one semiconductor element disposed on the top surface of the platform over the cavity.
A pick and place apparatus, comprising:
- a picked-up head configured to hold at least one semiconductor element;
- a controller electrically connected to the picked-up head and configured to output a signal to the picked-up head upon detecting an event;
- and
- a temporary storage device configured to receive the at least one semiconductor element from the picked-up head according to the signal, the temporary storage device comprising a platform having a top surface configured to support the at least one semiconductor element and a cavity recessed from the top surface.
Dependencies are inferred from the claim text.