H10W 72/012
Of bump connectors, dummy bumps or thermal bumps
Official title: {of bump connectors, dummy bumps or thermal bumps}
H10W72/012 (Of bump connectors, dummy bumps or thermal bumps) appears on 12,086 US grants and 13,152 published applications in this corpus.
Search patents in H10W- Granted patents
- 12,086
- Published applications
- 13,152
- Assignees
- 1,556
- Inventors
- 14,669
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 6 | 0 |
| 1978 | 3 | 0 |
| 1979 | 4 | 0 |
| 1980 | 5 | 0 |
| 1981 | 6 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 6 | 0 |
| 1986 | 3 | 0 |
| 1987 | 5 | 0 |
| 1988 | 10 | 0 |
| 1989 | 17 | 0 |
| 1990 | 21 | 0 |
| 1991 | 24 | 0 |
| 1992 | 37 | 0 |
| 1993 | 32 | 0 |
| 1994 | 39 | 0 |
| 1995 | 43 | 0 |
| 1996 | 68 | 0 |
| 1997 | 66 | 0 |
| 1998 | 107 | 0 |
| 1999 | 156 | 0 |
| 2000 | 201 | 0 |
| 2001 | 303 | 183 |
| 2002 | 343 | 374 |
| 2003 | 361 | 381 |
| 2004 | 332 | 427 |
| 2005 | 307 | 487 |
| 2006 | 297 | 454 |
| 2007 | 278 | 566 |
| 2008 | 294 | 576 |
| 2009 | 319 | 534 |
| 2010 | 417 | 427 |
| 2011 | 441 | 501 |
| 2012 | 418 | 521 |
| 2013 | 498 | 583 |
| 2014 | 517 | 646 |
| 2015 | 600 | 789 |
| 2016 | 717 | 640 |
| 2017 | 701 | 688 |
| 2018 | 619 | 593 |
| 2019 | 591 | 658 |
| 2020 | 600 | 654 |
| 2021 | 501 | 595 |
| 2022 | 488 | 473 |
| 2023 | 405 | 414 |
| 2024 | 405 | 451 |
| 2025 | 313 | 355 |
| 2026 | 152 | 182 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 72/01251Changing the shapes of bumps4,308
- H10W 72/01221Using local deposition3,710
- H10W 72/01231Using blanket deposition2,937
- H10W 72/01204Using temporary auxiliary members1,243
- H10W 72/01271Cleaning745
- H10W 72/01215Forming coatings634
- H10W 72/01212At a different location than on the final device347
- H10W 72/01208Using permanent auxiliary members287
All 10 subgroupsShow fewer
Recent patents
- Metal pillar for conductive connection6 Oct 2026US 12,757,750 B2Duksan Hi-Metal Co., Ltd.
- Semiconductor device and method of fabricating the same6 Oct 2026US 12,757,777 B2Samsung Electronics Co., Ltd.
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Repair of solder bumps29 Sep 2026US 12,746,613 B2Orbotech Ltd.
- Nano-roughened interconnects for integrated circuit packages29 Sep 2026US 12,751,312 B2Intel Corporation
- Wiring substrate8 Oct 2026US 2026/0309912 A1Ibiden Co., Ltd.
- Semiconductor packages and methods of manufacturing thereof8 Oct 2026US 2026/0314284 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Die attachment structure and method8 Oct 2026US 2026/0314435 A1NXP USA, Inc.
- Semiconductor device including bump structure8 Oct 2026US 2026/0314462 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Foundry Compatible, Ultra-low Resistance, Under-Bump-Metallization for Electroplated Bumps8 Oct 2026US 2026/0314479 A1
Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Package systems having interposers1,064US 9,048,233 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015