H10W 72/01271
Cleaning
Official title: {Cleaning, e.g. oxide removal or de-smearing}
H10W72/01271 (Cleaning) appears on 745 US grants and 924 published applications in this corpus.
Search patents in H10W- Granted patents
- 745
- Published applications
- 924
- Assignees
- 257
- Inventors
- 1,603
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 5 | 0 |
| 2001 | 10 | 5 |
| 2002 | 5 | 6 |
| 2003 | 11 | 12 |
| 2004 | 12 | 18 |
| 2005 | 8 | 16 |
| 2006 | 10 | 35 |
| 2007 | 15 | 37 |
| 2008 | 11 | 27 |
| 2009 | 14 | 23 |
| 2010 | 26 | 20 |
| 2011 | 20 | 46 |
| 2012 | 26 | 49 |
| 2013 | 37 | 51 |
| 2014 | 35 | 63 |
| 2015 | 50 | 55 |
| 2016 | 59 | 63 |
| 2017 | 63 | 67 |
| 2018 | 56 | 53 |
| 2019 | 49 | 54 |
| 2020 | 47 | 51 |
| 2021 | 36 | 43 |
| 2022 | 35 | 34 |
| 2023 | 32 | 27 |
| 2024 | 23 | 25 |
| 2025 | 27 | 24 |
| 2026 | 5 | 20 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing an interposer product15 Sep 2026US 12,740,435 B2Murata Manufacturing Co., Ltd.
- System and method for fluxless thermocompression bonding4 Aug 2026US 12,702,038 B2Asmpt Singapore Pte. Ltd.
- Hybrid underfill structures for multi-die packages and methods of forming the same23 Jun 2026US 12,667,020 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Solder reflow with optical endpoint control17 Feb 2026US 12,557,586 B1Yield Engineering Systems, Inc.
- Ultra small molded module integrated with die by module-on-wafer assembly13 Jan 2026US 12,525,544 B2Intel Corporation
- Hybrid Underfill Structures for Multi-Die Packages and Methods of Forming the Same1 Oct 2026US 2026/0305473 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Solder reflow with optical endpoint control24 Sep 2026US 2026/0293585 A1Yield Engineering Systems, Inc.
- Apparatus for preventing oxidation of electronic part6 Aug 2026US 2026/0231803 A1Shibuya Corporation
- Assembly structure and manufacturing method for manufacturing the same30 Jul 2026US 2026/0223713 A1Advanced Semiconductor Engineering, Inc.
- Alignment method of semiconductor chip, bonding method, semiconductor device, and electronic component manufacturing system30 Jul 2026US 2026/0223729 A1Tohoku University
Most cited
By later US patents
- Room temperature metal direct bonding236US 8,524,533 B2Ziptronix, Inc. · 2013
- Room temperature metal direct bonding220US 9,385,024 B2Ziptronix, Inc. · 2016
- Method for forming a flip chip on leadframe semiconductor package211US 6,550,666 B2Advanpack Solutions Pte Ltd. · 2003
- Method for room temperature metal direct bonding189US 6,962,835 B2Ziptronix, Inc. · 2005
- Semiconductor flip-chip assembly with pre-applied encapsulating layers169US 6,297,560 B12001