Assembly structure and manufacturing method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChih-Jing HSU, Yu-Yuan YEH, Zhao-Ze JIANG, Hsu-Nan FANG, Chen-Hung LEE, Che-Ming HSU, Min-Tzu HSU
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Abstract
An assembly structure includes a first electronic device, a second electronic device, a conductive portion and a dielectric structure. The second electronic device is disposed over the first electronic device. The conductive portion connects the first electronic device and the second electronic device. The dielectric structure encapsulates the conductive portion, and extends beyond a lateral surface of the first electronic device and a lateral surface of the second electronic device.
Claims20
An assembly structure, comprising:
- a first electronic device;
- a second electronic device disposed over the first electronic device;
- a conductive portion connecting the first electronic device and the second electronic device;
- and
- a dielectric structure encapsulating the conductive portion, and extending beyond a lateral surface of the first electronic device and a lateral surface of the second electronic device.
A manufacturing method, comprising:
- forming a first dielectric layer on a first electronic device to cover an end surface of a first reflowable material on the first electronic device, wherein the first dielectric layer includes an organic material;
- removing a portion of the first dielectric layer to expose the first reflowable material;
- forming a second dielectric layer on a second electronic device to cover an end surface of a second reflowable material on the second electronic device, wherein the second dielectric layer includes an organic material;
- removing a portion of the second dielectric layer to expose the second reflowable material;
- bonding the first dielectric layer and the second dielectric layer together to collectively form a dielectric structure;
- and
- fusing the first reflowable material and the second reflowable material together to collectively form a solder structure.
A manufacturing method, comprising:
- providing a first electronic device including a first pad embedded in and exposed by a first conductive structure of the first electronic device, wherein the first conductive structure includes an inorganic material;
- forming a second dielectric layer on a second electronic device, wherein the second dielectric layer exposes a second reflowable material, and includes an organic material;
- bonding the first conductive structure and the second dielectric layer;
- and
- bonding the first pad and the second reflowable material.
Dependencies are inferred from the claim text.