Method for room temperature metal direct bonding

A bonding method comprising:

• preparing a first substrate having a first plurality of metallic pads and a first non-metallic bonding region proximate to the metallic pads on the first substrate;
• preparing a second substrate having a second plurality of metallic pads and a second non-metallic bonding region proximate to the metallic pads on the second substrate;
• contacting at least one pad from said first plurality of metallic pads with at least one pad from said second plurality of metallic pads;
• directly contacting said first non-metallic bonding region to said second non-metallic bonding region;
• and
• bonding said first non-metallic bonding region to said second non-metallic bonding region,
• wherein:
• preparing said first substrate comprises forming a plurality of third substrates, each smaller than said second substrate and each having at least one third metallic pad;
• contacting said at least one pad comprises contacting a third metallic pad of each of said third substrates with one of said second plurality of metallic pads;
• directly contacting comprises contacting a third non-metallic bonding region of each of said third substrates with said second non-metallic bonding region of said second substrate;
• and
• said bonding comprises bonding said third non-metallic bonding regions to said second non-metallic bonding region.

A bonding method, comprising:

• preparing a first substrate having a first plurality of metallic pads and a first non-metallic bonding region proximate to the metallic pads on the first substrate;
• preparing a second substrate having a second plurality of metallic pads and a second non-metallic bonding region proximate to the metallic pads on the second substrate;
• contacting at least one pad from said first plurality of metallic pads with at least one pad from said second plurality of metallic pads;
• directly contacting said first non-metallic bonding region to said second non-metallic bonding region;
• bonding said first non-metallic bonding region to said second non-metallic bonding region;
• forming a void beneath said at least one of said first plurality of metallic pads;
• and
• deforming a material beneath said at least one of said first plurality of metallic pads to extend into said void.

A bonding method comprising:

• preparing a first substrate having a first plurality of metallic pads and a first non-metallic bonding region proximate to the metallic pads on the first substrate;
• preparing a second substrate having a second plurality of metallic pads and a second non-metallic bonding region proximate to the metallic pads on the second substrate;
• contacting a first pad from said first plurality of metallic pads with a second pad from said second plurality of metallic pads;
• directly contacting said first non-metallic bonding region to said second non-metallic bonding region;
• bonding said first non-metallic bonding region to said second non-metallic bonding region;
• and
• forming a void beneath at least one of said first and second pads having lateral dimensions greater than that of said at least one of said first and second pads.

A bonding method comprising:

• preparing a first substrate having a first plurality of metallic pads and a first non-metallic bonding region proximate to the metallic pads on the first substrate;
• preparing a second substrate having a second plurality of metallic pads and a second non-metallic bonding region proximate to the metallic pads on the second substrate;
• contacting at least one pad from said first plurality of metallic pads with at least one pad from said second plurality of metallic pads;
• directly contacting said first non-metallic bonding region to said second non-metallic bonding region;
• bonding said first non-metallic bonding region to said second non-metallic bonding region;
• and
• disposing a deformable low K dielectric material beneath said at least one of said first plurality of pads.

A bonding method comprising:

• preparing a first substrate having a first plurality of metallic pads and a first non-metallic bonding region proximate to the metallic pads on the first substrate;
• preparing a second substrate having a second plurality of metallic pads and a second non-metallic bonding region proximate to the metallic pads on the second substrate;
• contacting at least one pad from said first plurality of metallic pads with at least one pad from said second plurality of metallic pads;
• directly contacting said first non-metallic bonding region to said second non-metallic bonding region;
• bonding said first non-metallic bonding region to said second non-metallic bonding region;
• and
• reducing an unbonded area around at least one of said first plurality of pads using a deformable low K dielectric material disposed proximate to said at least one of said first plurality of pads.

A bonding method comprising:

• preparing a first substrate having a first bonding pad and a first non-metallic bonding region proximate to said first bonding pad;
• preparing a second substrate having a second bonding pad and a second non-metallic bonding region proximate to said second bonding pad;
• bringing said first bonding pad into physical contact with said second bonding pad;
• bringing said first non-metallic bonding region into physical contact with said second non-metallic bonding region;
• and
• forming a chemical bond between said first non-metallic bonding region and said second non-metallic bonding region.

A bonding method comprising:

• forming a first pad comprised of a metallic material on a first substrate, said first substrate having a first non-metallic bonding region proximate to the first pad and an upper surface of said first pad being formed below a surface of said first non-metallic bonding region;
• forming a second pad comprised of a metallic material on a second substrate, said second substrate having a second non-metallic bonding region proximate to said second pad;
• bringing said first and second non-metallic banding regions into contact without contacting together said first and second pads, and forming a direct bond between said first and second non-metallic bonding regions;
• and
• heating said first and second pads after said bonding to cause said material from at least one of said first and second pads to form a portion connected with the other of said first and said second pads.

A bonding method comprising:

• preparing a first substrate having a first plurality of metallic pads and a first non-metallic bonding region proximate to the metallic pads on the first substrate;
• preparing a second substrate having a second plurality of metallic pads and a second non-metallic bonding region proximate to the metallic pads on the second substrate;
• directly contacting at least one pad from said first plurality of metallic pads with at least one pad from said second plurality of metallic pads;
• directly contacting said first non-metallic bonding region to said second non-metallic bonding region by elastically deforming at least one of said first and second substrates;
• and
• bonding said first non-metallic bonding region to said second non-metallic bonding region.

A bonding method, comprising:

• preparing a die having at least one first metallic pad and a first non-metallic bonding region proximate to said first metallic pad;
• preparing a substrate having a second metallic pad and a second non-metallic bonding region proximate to said second metallic pad on the substrate;
• directly contacting, without solder, said first metallic pad with said second metallic pad;
• directly contacting said first non-metallic bonding region to said second non-metallic bonding region;
• and
• nonadhesively bonding said first non-metallic bonding region to said second non-metallic bonding region.