Alignment method of semiconductor chip, bonding method, semiconductor device, and electronic component manufacturing system

A bonding method, which is a bonding method of laminating and bonding a first semiconductor chip to a plate-shaped electronic component, the bonding method comprising:

• a thin film forming process of coating a photoexcited hydrophilization reactant onto a surface of the electronic component and an opposing surface of the first semiconductor chip that is opposed to the surface, to form a surface thin film and an opposing surface thin film;
• a hydrophilization process of irradiating light onto a hydrophilization region, which is a part of the surface thin film, and a chip hydrophilization region of the opposing surface thin film that is opposed to the hydrophilization region, to hydrophilize the hydrophilization region and the chip hydrophilization region;
• a droplet attaching process of attaching a droplet to the hydrophilized hydrophilization region of the electronic component;
• a self-alignment process of loading the hydrophilized chip hydrophilization region of the first semiconductor chip onto the droplet, and causing the chip hydrophilization region of the first semiconductor chip to self-align with respect to the hydrophilization region of the electronic component by surface tension of the droplet;
• and
• a bonding process of bringing the hydrophilized chip hydrophilization region of the opposing surface thin film into contact with the hydrophilized hydrophilization region of the surface thin film to hydrophilically bond the hydrophilization region of the surface thin film and the chip hydrophilization region of the opposing surface thin film.

An electronic component manufacturing system, which is an electronic component manufacturing system laminating and bonding a first semiconductor chip to a plate-shaped electronic component, the electronic component manufacturing system comprising:

• a thin film forming apparatus, a hydrophilization apparatus, and a bonding apparatus, wherein
• the thin film forming apparatus coats a photoexcited hydrophilization reactant onto a surface of the electronic component and an opposing surface of the first semiconductor chip that is opposed to the surface to form a surface thin film and an opposing surface thin film, and supplies the electronic component formed with the surface thin film and the first semiconductor chip formed with the opposing surface thin film to the hydrophilization apparatus,
• the hydrophilization apparatus irradiates light onto a hydrophilization region, which is a part of the surface thin film, and a chip hydrophilization region of the opposing surface thin film that is opposed to the hydrophilization region to hydrophilize the hydrophilization region and the chip hydrophilization region, and supplies the hydrophilized electronic component and the hydrophilized first semiconductor chip to the bonding apparatus,
• the bonding apparatus bonds the first semiconductor chip to the electronic component supplied from the hydrophilization apparatus, and comprises:
• a stage that adsorbs and fixes the electronic component;
• a collet that holds and releases the first semiconductor chip;
• a dispenser that attaches a droplet to the surface of the electronic component;
• a bonding head that moves the collet in each of a direction along the stage and a direction contacting and separating from the stage;
• a dispenser head that moves the dispenser in each of a direction along the stage and a direction contacting and separating from the stage;
• a pressing device that presses the first semiconductor chip against the electronic component adsorbed and fixed on the stage;
• and
• a control part that adjusts operations of the collet, the dispenser, the bonding head, the dispenser head, and the pressing device, wherein
• the control part comprises a processor that performs information processing, and
• the processor is configured to:
• attach, by the dispenser, the droplet to the hydrophilized hydrophilization region of the electronic component adsorbed and fixed on the stage,
• load, by the collet, the hydrophilized chip hydrophilization region of the first semiconductor chip onto the droplet, and cause the chip hydrophilization region of the first semiconductor chip to self-align with respect to the hydrophilization region of the electronic component by surface tension of the droplet, and
• press, by the pressing device, the hydrophilized chip hydrophilization region of the opposing surface thin film against the hydrophilized hydrophilization region of the surface thin film to hydrophilically bond the hydrophilization region of the surface thin film and the chip hydrophilization region of the opposing surface thin film.