H10W 72/01251
Changing the shapes of bumps
Official title: {Changing the shapes of bumps}
H10W72/01251 (Changing the shapes of bumps) appears on 4,308 US grants and 4,843 published applications in this corpus.
Search patents in H10W- Granted patents
- 4,308
- Published applications
- 4,843
- Assignees
- 714
- Inventors
- 5,874
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 10 | 0 |
| 1991 | 7 | 0 |
| 1992 | 12 | 0 |
| 1993 | 15 | 0 |
| 1994 | 13 | 0 |
| 1995 | 18 | 0 |
| 1996 | 28 | 0 |
| 1997 | 17 | 0 |
| 1998 | 27 | 0 |
| 1999 | 37 | 0 |
| 2000 | 57 | 0 |
| 2001 | 71 | 45 |
| 2002 | 90 | 89 |
| 2003 | 98 | 118 |
| 2004 | 101 | 130 |
| 2005 | 90 | 147 |
| 2006 | 79 | 155 |
| 2007 | 84 | 235 |
| 2008 | 112 | 196 |
| 2009 | 98 | 151 |
| 2010 | 134 | 138 |
| 2011 | 147 | 199 |
| 2012 | 160 | 221 |
| 2013 | 200 | 276 |
| 2014 | 212 | 287 |
| 2015 | 270 | 310 |
| 2016 | 290 | 254 |
| 2017 | 298 | 267 |
| 2018 | 238 | 215 |
| 2019 | 203 | 242 |
| 2020 | 227 | 250 |
| 2021 | 198 | 247 |
| 2022 | 189 | 201 |
| 2023 | 146 | 136 |
| 2024 | 159 | 126 |
| 2025 | 115 | 121 |
| 2026 | 49 | 87 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Repair of solder bumps29 Sep 2026US 12,746,613 B2Orbotech Ltd.
- Nano-roughened interconnects for integrated circuit packages29 Sep 2026US 12,751,312 B2Intel Corporation
- Integrated device comprising stacked inductors with low or no mutual inductance15 Sep 2026US 12,740,406 B2QUALCOMM Incorporated
- Semiconductor device with a metal array portion with removed corners to reduce metal portion height variations15 Sep 2026US 12,740,466 B2Kabushiki Kaisha Toshiba
- Wiring substrate8 Oct 2026US 2026/0309912 A1Ibiden Co., Ltd.
- Integrated circuit structure and manufacturing method thereof8 Oct 2026US 2026/0314480 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor packages with separately plated metal pillars1 Oct 2026US 2026/0305410 A1Texas Instruments Incorporated
- Method for manufacturing semiconductor device, and insulating resin material1 Oct 2026US 2026/0305434 A1Resonac Corporation
- Method for manufacturing semiconductor device1 Oct 2026US 2026/0305435 A1Resonac Corporation
Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Process of fabricating three-dimensional semiconductor device576US 4,612,083 ANEC Corporation · 1986
- Semiconductor integrated circuit device and method of manufacturing the same437US 4,982,265 AAkita Electronics Co., Ltd. · 1991
- Multi-chip programmable logic device having configurable logic circuitry and configuration data storage on different dice399US 6,917,219 B2Xilinx, Inc. · 2005