H10W 72/01253
By etching
Official title: {by etching}
H10W72/01253 (By etching) appears on 200 US grants and 234 published applications in this corpus.
Search patents in H10W- Granted patents
- 200
- Published applications
- 234
- Assignees
- 80
- Inventors
- 427
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 1 |
| 2005 | 0 | 3 |
| 2006 | 2 | 1 |
| 2007 | 2 | 2 |
| 2008 | 0 | 2 |
| 2009 | 2 | 2 |
| 2010 | 3 | 4 |
| 2011 | 1 | 6 |
| 2012 | 1 | 7 |
| 2013 | 8 | 16 |
| 2014 | 13 | 19 |
| 2015 | 14 | 21 |
| 2016 | 18 | 21 |
| 2017 | 24 | 23 |
| 2018 | 15 | 14 |
| 2019 | 14 | 19 |
| 2020 | 20 | 20 |
| 2021 | 15 | 14 |
| 2022 | 18 | 17 |
| 2023 | 10 | 8 |
| 2024 | 9 | 5 |
| 2025 | 6 | 4 |
| 2026 | 3 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Nano-roughened interconnects for integrated circuit packages29 Sep 2026US 12,751,312 B2Intel Corporation
- Density distribution of conductive bumps on wafer24 Mar 2026US 12,588,534 B2Shinko Electric Industries Co., Ltd.
- Integrated circuit packages and methods of forming the same10 Feb 2026US 12,550,417 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Expanded head pillar for bump bonds23 Dec 2025US 12,506,097 B2Texas Instruments Incorporated
- Back plate and manufacturing method thereof, method for bonding chip, and display device9 Sep 2025US 12,412,866 B2Boe Technology Group Co., Ltd.
- Electronic device and a method for making the same30 Jul 2026US 2026/0223753 A1STATS ChipPAC Management Pte. Ltd.
- Integrated circuit packages and methods of forming the same14 May 2026US 2026/0136644 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure and method of forming the same14 May 2026US 2026/0136922 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Composite packages for enhancing thermal dissipation and methods for forming the same9 Apr 2026US 2026/0101780 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Multi-faced molded semiconductor package and related methods18 Sep 2025US 2025/0293032 A1Semiconductor Components Industries, LLC
Most cited
By later US patents
- 3D IC method and device388US 7,485,968 B2Ziptronix, Inc. · 2009
- 3D IC method and device251US 9,171,756 B2Ziptronix, Inc. · 2015
- Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment77US 7,098,127 B2Seiko Epson Corporation · 2006
- Wireless communication technology, apparatuses, and methods58US 11,424,539 B2Intel Corporation · 2022
- 3D IC method and device48US 10,147,641 B2Invensas Bonding Technologies, Inc. · 2018