Package structure and method of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYou Ru Lee, Ching Yang Chen, Yi Ping Chiang, Hsin Ying Lin
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Abstract
A package structure includes forming a semiconductor substrate for RF application, a first ultra thick metal disposed over the semiconductor substrate, a second ultra thick metal disposed over the first ultra thick metal, and a bump structure directed formed on the second ultra thick metal. The second ultra thick metal is coupled to the first ultra thick metal. A patterned ground shield (PGS) structure may be formed over the semiconductor substrate and below the first ultra thick metal.
Claims20
A package structure, comprising:
- a semiconductor substrate;
- a first ultra thick metal (UTM) disposed over the semiconductor substrate;
- a second ultra thick metal disposed over and coupled to the first ultra thick metal;
- and
- a bump structure directly disposed on the second ultra thick metal.
A package structure, comprising:
- a semiconductor substrate with a semiconductor device;
- a patterned ground shield (PGS) structure formed over the semiconductor substrate and overlapped with the semiconductor device in a thickness direction;
- a radio frequency (RF) circuit disposed over the PGS structure, wherein the RF circuit comprises a first ultra thick metal (UTM) close to the PGS structure and a second ultra thick metal disposed over the first ultra thick metal and separated from the PGS structure by a predetermined distance;
- and
- a bump structure directed formed on the second ultra thick metal.
A method of forming a package structure, comprising:
- providing a semiconductor substrate with a semiconductor device;
- forming a patterned ground shield (PGS) structure over the semiconductor device of the semiconductor substrate;
- forming a first ultra thick metal (UTM) over the PGS structure;
- forming a second ultra thick metal over the first ultra thick metal;
- and
- forming a bump structure on the second ultra thick metal.
Dependencies are inferred from the claim text.