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US 2026/0101780 A1Published application
Composite packages for enhancing thermal dissipation and methods for forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKai-Fung Chang, Li-Hui Cheng, Ying-Ching Shih
Life of this patent
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Abstract
A composite package may have a feature for enhancing thermal dissipation. The feature may include an array of metal pillar located on a backside a semiconductor die. Alternatively, the feature may include a cavity, to which a backside surface of a semiconductor die is exposed and which is laterally surrounded by a portion of a molding compound die frame.
Claims20
A method of forming a composite package comprising:
- forming an array of metal pillars on a backside of a first semiconductor die;
- forming a first molding compound frame around the array of metal pillars;
- attaching a second semiconductor die and an assembly comprising the first semiconductor die, the array of metal pillars, and the first molding compound frame to an interposer;
- and
- forming a second molding compound frame around the assembly and the second semiconductor die.
2 more elements
A method of forming a composite package comprising:
- forming a stack of a first semiconductor die and a spacer that is attached to a backside of the first semiconductor die;
- attaching the stack and a second semiconductor die to a wafer;
- forming a multi-die molding compound frame around the stack and the second semiconductor die;
- and
- attaching an interposer on a combination of the stack, the second semiconductor die, and the multi-die molding compound frame.
2 more elements
A composite package, comprising:
- an interposer;
- an assembly that is attached to the interposer and comprising a first semiconductor die, an array of metal pillars located on a backside of the first semiconductor die, and a first molding compound frame laterally surrounding the array of metal pillars;
- a second semiconductor die that is attached to the interposer;
- and
- a second molding compound frame laterally surrounding the assembly and the second semiconductor die.
2 more elements
Dependencies are inferred from the claim text.