Back plate and manufacturing method thereof, method for bonding chip, and display device
AssigneeBoe Technology Group Co., Ltd.
InventorsGuangcai Yuan, Zhiwei Liang, Ke Wang, Zhanfeng Cao
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AssigneeBoe Technology Group Co., Ltd.
InventorsGuangcai Yuan, Zhiwei Liang, Ke Wang, Zhanfeng Cao
Estimating the term…
A back plate and a manufacturing method thereof, a method for bonding a chip, and a display device are provided. The back plate includes: a base substrate; and, a plurality of conductive connecting tubes disposed on the base substrate, wherein one end of each of the conductive connecting tubes is connected to the base substrate, and a side wall of each of the conductive connecting tubes is provided with an opening penetrating the side wall. And, the method for bonding a chip includes: providing the back plate; inserting an electrode of the chip into a corresponding conductive connecting tube from an end of the conductive connecting tube away from the base substrate; and heating the conductive connecting tube and the chip, so that the electrode of the chip is electrically connected to the conductive connecting tube.
A back plate, comprising:
A method for manufacturing a back plate, comprising:
A method for bonding a chip, comprising:
Dependencies are inferred from the claim text.