US 11,424,539 B2 · Wireless communication technology, apparatuses, and methods

Wireless communication technology, apparatuses, and methods

AssigneeIntel Corporation

InventorsErkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asl, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin

Life of this patent

Estimating the term…

Abstract

Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.

Claims6

Dependent claims

An apparatus for a mobile device, the apparatus comprising:

a printed circuit board (PCB) that comprises a first layer and a second layer;
an integrated circuit (IC) chip that comprises a top level and a bottom level, wherein the IC chip comprises a transceiver and the IC chip is connected to the first layer of the PCB;
an antenna array that comprises a plurality of antenna elements configured within the first layer of the PCB and fed by feed transmission lines coupled to the transceiver;
and
an IC shield, separated from the antenna array, that covers the IC to shield the antenna array from interference generated by the IC, and is connected to the PCB, wherein the IC shield is configured to act as a reflector and a ground reference for the antenna array.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

16/472,830Filed 20 Dec 2017 · us provisional application

Priority

21 Dec 2016

Published

US 2020/0091608 A119 Mar 2020

Granted

23 Aug 2022

Term ends

Not estimatedThe source records don’t support an estimate.

Classification61 codes

H01Q 9/0414
Substantially flat resonant element parallel to ground plane, e.g. patch antenna: in a stacked or folded configuration
H01Q 1/2283
By structural association with other equipment or articles: mounted in or on the surface of a semiconductor substrate as a chip-type antenna or…
H01Q 1/243
Specially adapted for hand-held use: with built-in antennas
H01Q 1/38
Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith: formed by a conductive layer on an…

Family

Application62/437,385Us provisional application · filed 21 Dec 2016

Application62/511,398Us provisional application · filed 26 May 2017

Application62/527,818Us provisional application · filed 30 Jun 2017

Application62/570,680Us provisional application · filed 11 Oct 2017

US 2020/0091608 A1Pre-grant publication · published 19 Mar 2020

US 11,424,539 B2This patent

From the US filing history. Foreign family members aren’t listed.