Integrated circuit packages and methods of forming the same

A method comprising:

• bonding a plurality of dies to a first substrate, each of the plurality of dies comprising:
• a semiconductor substrate;
• and
• an interconnect structure on the semiconductor substrate;
• after bonding the plurality of dies to the first substrate, doping top surfaces and sidewalls of each semiconductor substrate of the plurality of dies with a first dopant such that a hydrophobicity of the sidewalls of each semiconductor substrate decreases in the vertical direction from a top surface of the semiconductor substrate towards a bottom surface of the semiconductor substrate;
• and
• forming a dielectric material between each of the plurality of dies.

A package comprising:

• a redistribution structure;
• a first die over and electrically coupled to the redistribution structure;
• and
• a first dielectric material encapsulating the first die, wherein sidewalls of the first die comprise a first dopant, wherein a concentration of the first dopant in the sidewalls of the first die decreases in the vertical direction from a top surface of the first die towards a bottom surface of the first die.