Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment

A method for manufacturing a semiconductor comprising:

• forming a plurality of electrodes on portions of a semiconductor element
• forming a first conductive layer by electroless nickel plating on the plurality of the electrodes before applying a layer of a resin in a subsequent step;
• applying the layer of the resin to the semiconductor element in a region of the semiconductor element that does not include the electrodes, the layer of the resin being applied such that a height of the layer of the resin is greater than a height of the electrodes;
• forming a second conductive layer over the plurality of the electrodes and the layer of the resin, the second conductive layer being connected to the first conductive layer and covering a top surface of the layer of the resin;
• patterning the second conductive layer on the electrodes and the layer of the resin in a predetermined pattern;
• and
• removing portions of the layer of the resin using the patterned second conductive layer as a mask so that remaining portions of the layer of the resin form a plurality of protrusions.