US 12,506,097 B2 · Expanded head pillar for bump bonds

Abstract

A microelectronic device has a bump bond structure including an electrically conductive pillar with an expanded head, and solder on the expanded head. The electrically conductive pillar includes a column extending from an I/O pad to the expanded head. The expanded head extends laterally past the column on at least one side of the electrically conductive pillar. In one aspect, the expanded head may have a rounded side profile with a radius approximately equal to a thickness of the expanded head, and a flat top surface. In another aspect, the expanded head may extend past the column by different lateral distances in different lateral directions. In a further aspect, the expanded head may have two connection areas for making electrical connections to two separate nodes. Methods for forming the microelectronic device are disclosed.

Claims25

Dependent claims

A device comprising:

an I/O pad of a substrate, wherein the substrate is a semiconductor die;
a column on the I/O pad;
a head on the column and extending on all lateral sides of the column, a portion of a surface of the head, vertically aligned with the column in a cross-sectional view of the device, is substantially parallel to a top surface of the substrate, wherein a length of the portion of the surface of the head is same as a diameter of the column in the cross-sectional view;
and solder on the head, wherein the head is attached to a portion of a lead frame via solder, wherein the head has a rounded side profile on portions excluding the portion of the surface of the head, the rounded side profile with a uniform radius that is equal to a vertical thickness of the head, at the portion of the surface of the head.

1 more element

Dependencies are inferred from the claim text.

Expanded head pillar for bump bonds

Life of this patent

Expanded head pillar for bump bonds

Life of this patent

Abstract

Claims25