H10W 72/01257
By reflowing
Official title: {by reflowing}
H10W72/01257 (By reflowing) appears on 1,669 US grants and 1,981 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,669
- Published applications
- 1,981
- Assignees
- 324
- Inventors
- 2,590
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 4 | 0 |
| 2001 | 8 | 2 |
| 2002 | 8 | 10 |
| 2003 | 10 | 14 |
| 2004 | 9 | 18 |
| 2005 | 16 | 30 |
| 2006 | 9 | 25 |
| 2007 | 16 | 23 |
| 2008 | 19 | 32 |
| 2009 | 20 | 29 |
| 2010 | 20 | 41 |
| 2011 | 26 | 83 |
| 2012 | 54 | 112 |
| 2013 | 77 | 136 |
| 2014 | 93 | 163 |
| 2015 | 143 | 166 |
| 2016 | 163 | 146 |
| 2017 | 182 | 136 |
| 2018 | 125 | 111 |
| 2019 | 116 | 125 |
| 2020 | 110 | 131 |
| 2021 | 103 | 127 |
| 2022 | 98 | 91 |
| 2023 | 81 | 65 |
| 2024 | 77 | 60 |
| 2025 | 45 | 61 |
| 2026 | 19 | 44 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Repair of solder bumps29 Sep 2026US 12,746,613 B2Orbotech Ltd.
- Integrated device comprising stacked inductors with low or no mutual inductance15 Sep 2026US 12,740,406 B2QUALCOMM Incorporated
- Pad metallization with oxide layer to reduce deformation of conductive films18 Aug 2026US 12,713,960 B2Renesas Electronics Corporation
- Thick redistribution layer features11 Aug 2026US 12,707,653 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Ball grid array assembly using a solder paste mix and method of using a solder paste dip11 Aug 2026US 12,707,987 B1Frontgrade Technologies Inc.
- Wiring substrate8 Oct 2026US 2026/0309912 A1Ibiden Co., Ltd.
- Integrated circuit structure and manufacturing method thereof8 Oct 2026US 2026/0314480 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure and fabrication method thereof1 Oct 2026US 2026/0305439 A1United Microelectronics Corp.
- Semiconductor structure, semiconductor package, and method for forming semiconductor structure17 Sep 2026US 2026/0283006 A1CXMT Corporation
- Method for forming copper pillars by thick film screen printing10 Sep 2026US 2026/0271632 A1
Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method for fabricating encapsulated semiconductor components235US 6,908,784 B1Micron Technology, Inc. · 2005
- Bump structure, bump forming method and package connecting body200US 6,229,220 B1International Business Machines Corporation · 2001
- Semiconductor device with bump structure196US 5,656,858 ANippondenso Co., Ltd. · 1997