Method for forming copper pillars by thick film screen printing
OwnerKezia Cheng, Raymond Mitchell Waugh +3inventors
InventorsKezia Cheng, Raymond Mitchell Waugh, Boris Dzyubenko, Michael J. Duval, Eric Paul Finchem
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Abstract
Aspects and embodiments disclosed herein include a method of forming copper pillars on a semiconductor substrate. The method comprises disposing a screen printing stencil above the semiconductor substrate, screen printing a copper paste through apertures in the screen printing stencil on to the semiconductor substrate, and sintering the copper paste to form discrete copper pillars.
Claims20
A method of forming copper pillars on a semiconductor substrate, the method comprising:
- disposing a screen printing stencil above the semiconductor substrate;
- screen printing a copper paste through apertures in the screen printing stencil and onto the semiconductor substrate;
- and
- sintering the copper paste to form discrete copper pillars.
A method of forming copper pillars on a semiconductor substrate, the method comprising:
- depositing a layer of photoresist on an upper surface of the semiconductor substrate;
- defining a cavity in the layer of photoresist;
- depositing copper paste within the cavity;
- sintering the copper paste to form a solidified copper pillar within the cavity;
- removing an upper portion of the layer of photoresist;
- depositing solder on an upper end of the solidified copper pillar while leaving a lower portion of the layer of photoresist in place about a lower portion of the solidified copper pillar;
- and
- reflowing the solder.
A method of mounting a semiconductor die to a multichip module substrate, the method comprising:
- depositing a layer of photoresist on an upper surface of the semiconductor die;
- defining a cavity in the layer of photoresist;
- depositing copper paste within the cavity;
- sintering the copper paste to form a solidified copper pillar within the cavity;
- placing a stencil over an upper surface of the multichip module substrate;
- depositing solder paste through the stencil onto the upper surface of the multichip module substrate;
- reflowing the deposited solder paste to form a solder contact;
- flip chip mounting the semiconductor die onto the multichip module substrate, the solidified copper pillar being aligned with the solder contact;
- and
- bonding the solidified copper pillar to the solder contact.
Dependencies are inferred from the claim text.