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US 12,740,466 B2Granted
Semiconductor device with a metal array portion with removed corners to reduce metal portion height variations
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorYoshiaki Shimooka
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Abstract
According to one embodiment, a semiconductor device includes a semiconductor substrate and an array portion. The array portion includes a plurality of metal portions arranged on the semiconductor substrate. When a virtual quadrilateral circumscribing minimally a contour shape of the array portion on the semiconductor substrate is set, the contour shape of the array portion does not overlap each of four vertices of the virtual quadrilateral.
Claims14
A semiconductor device comprising:
- a semiconductor substrate;
- and
- an array portion including a plurality of metal portions arranged on the semiconductor substrate, wherein
- when a virtual quadrilateral minimally circumscribing a contour shape of the array portion on the semiconductor substrate is set, the contour shape of the array portion does not overlap any of four vertices of the virtual quadrilateral,
- a shortest distance from a vertex of the virtual quadrilateral to the array portion is 1.5% or more of a length of a diagonal line of the virtual quadrilateral,
- each of the plurality of metal portions has a height of 5 μm or more and 40 μm or less, and
- a first height of a first metal portion is between 1.0 and 1.1 times a second height of a second metal portion, the first metal portion being a tallest metal portion among the plurality of metal portions, the second metal portion being a shortest metal portion among the plurality of metal portions.
4 more elements
Dependencies are inferred from the claim text.