H10W 72/01204
Using temporary auxiliary members
Official title: {using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates}
H10W72/01204 (Using temporary auxiliary members) appears on 1,243 US grants and 1,232 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,243
- Published applications
- 1,232
- Assignees
- 317
- Inventors
- 2,094
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 5 | 0 |
| 1993 | 6 | 0 |
| 1994 | 5 | 0 |
| 1995 | 5 | 0 |
| 1996 | 8 | 0 |
| 1997 | 10 | 0 |
| 1998 | 18 | 0 |
| 1999 | 28 | 0 |
| 2000 | 31 | 0 |
| 2001 | 36 | 13 |
| 2002 | 41 | 29 |
| 2003 | 26 | 23 |
| 2004 | 16 | 31 |
| 2005 | 30 | 32 |
| 2006 | 25 | 27 |
| 2007 | 16 | 32 |
| 2008 | 17 | 47 |
| 2009 | 26 | 59 |
| 2010 | 49 | 47 |
| 2011 | 37 | 46 |
| 2012 | 51 | 59 |
| 2013 | 46 | 65 |
| 2014 | 53 | 60 |
| 2015 | 62 | 75 |
| 2016 | 68 | 58 |
| 2017 | 64 | 77 |
| 2018 | 71 | 81 |
| 2019 | 82 | 88 |
| 2020 | 70 | 63 |
| 2021 | 58 | 50 |
| 2022 | 44 | 64 |
| 2023 | 38 | 30 |
| 2024 | 47 | 39 |
| 2025 | 28 | 24 |
| 2026 | 12 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Package substrate with embedded device, and manufacturing method therefor26 May 2026US 12,642,104 B2Zhuhai ACCESS Semiconductor Co., Ltd.
- Indium bump fabrication on non-planar surface19 May 2026US 12,635,547 B1United States of America as represented by the Administrator of NASA
- Integrated circuit package and method21 Apr 2026US 12,610,873 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor packages and methods of manufacturing thereof8 Oct 2026US 2026/0314284 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for manufacturing semiconductor device1 Oct 2026US 2026/0305435 A1Resonac Corporation
- Laser printing method for microbumps in packaging three-dimensional integrated circuit17 Sep 2026US 2026/0282988 A1Shanghai Jiao Tong University
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- Method for making semiconductor device3 Sep 2026US 2026/0262533 A1STATS ChipPAC Pte. Ltd.
Most cited
By later US patents
- Package systems having interposers1,064US 9,048,233 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Packaging methods and structures using a die attach film854US 9,064,879 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Embedded wafer-level bonding approaches616US 8,361,842 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013