Integrated circuit package and method

A packaged system comprising:

• a first integrated circuit package having a first plurality of integrated circuit dies encapsulated by a first encapsulant;
• a second integrated circuit package bonded to the first integrated circuit package, the second integrated circuit package having a second plurality of integrated circuit dies;
• a cold plate coupled to a top side of the second integrated circuit package with a first thermal interface material;
• and
• a heat spreader coupled to a bottom side of the first integrated circuit package with a second thermal interface material.

A semiconductor package assembly comprising:

• a first package substrate having a plurality of integrated circuits embedded in a molding material;
• a second package substrate mounted above the first package substrate, the second package substrate comprising multiple semiconductor dies;
• a thermal dissipation element thermally coupled to an upper surface of the second package substrate through a first thermal interface layer;
• and
• a thermal spreader element thermally coupled to a lower surface of the first package substrate through a second thermal interface layer, wherein the thermal spreader element has a larger surface area than the first package substrate.