Indium bump fabrication on non-planar surface

A method, comprising:

• providing a substrate having a rigid layer and a flexible layer, the flexible layer being at least 10 microns thick and being disposed on a portion of the rigid layer;
• layering a photoresist material on the rigid layer and the flexible layer, wherein the photoresist material has a thickness T, and wherein the photoresist material is not in contact with peripheral edges of the flexible layer and surface regions of the rigid layer adjacent to the peripheral edges of the flexible layer;
• removing portions of the photoresist material to uncover corresponding portions of the rigid layer;
• positioning a shadow mask on the photoresist material that is on the flexible layer, wherein the shadow mask extends over the surface regions of the rigid layer adjacent to the peripheral edges of the flexible layer;
• depositing indium to a thickness Ti on the corresponding portions of the rigid layer that are uncovered, wherein Ti<T;
• and
• removing the shadow mask and the photoresist material.

A method, comprising:

• providing a substrate having a rigid material and a flexible material disposed on a surface portion of the rigid material, wherein a surface of the substrate that includes the rigid material and the flexible material is non-planar;
• laying up n plies of a laminated photoresist material on the surface of the substrate, wherein the n plies are not in contact with peripheral edges of the flexible material and surface regions of the rigid material adjacent to the peripheral edges of the flexible material;
• developing, after the step of laying up, the n plies n separate times;
• removing regions of the n plies to uncover corresponding portions of the rigid material;
• positioning a shadow mask over the n plies that are on the flexible material and over the surface regions of the rigid material adjacent to the peripheral edges of the flexible material;
• depositing indium on the corresponding portions of the rigid material that are uncovered;
• and
• removing the shadow mask and the photoresist material.