Method for making semiconductor device

A method for making a semiconductor device, comprising:

• providing a package comprising a substrate comprising a top surface and a bottom surface, a top electronic component mounted on the top surface of the substrate, a bottom electronic component mounted on the bottom surface of the substrate, at least one conductive pillar formed on the bottom surface of the substrate, and a protection layer attached onto the bottom surface of the substrate and covering the bottom electronic component and the conductive pillar;
• providing a molding apparatus comprising a top chase and a bottom chase, wherein a molding material is held in the bottom chase;
• attaching the package onto the top chase of the molding apparatus via the protection layer;
• and
• moving the top chase and the bottom chase close to each other to compress the molding material to cover the top electronic component on the top surface of the substrate, thereby forming a top encapsulation on the top surface of the substrate.