H10W 72/01212
At a different location than on the final device
Official title: {at a different location than on the final device, e.g. forming solder preforms}
H10W72/01212 (At a different location than on the final device) appears on 347 US grants and 374 published applications in this corpus.
Search patents in H10W- Granted patents
- 347
- Published applications
- 374
- Assignees
- 149
- Inventors
- 737
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 5 | 0 |
| 1999 | 3 | 0 |
| 2000 | 3 | 0 |
| 2001 | 8 | 3 |
| 2002 | 5 | 5 |
| 2003 | 4 | 5 |
| 2004 | 4 | 3 |
| 2005 | 3 | 9 |
| 2006 | 3 | 9 |
| 2007 | 9 | 9 |
| 2008 | 5 | 10 |
| 2009 | 2 | 13 |
| 2010 | 14 | 13 |
| 2011 | 6 | 14 |
| 2012 | 14 | 17 |
| 2013 | 17 | 23 |
| 2014 | 17 | 27 |
| 2015 | 19 | 37 |
| 2016 | 30 | 15 |
| 2017 | 20 | 28 |
| 2018 | 35 | 25 |
| 2019 | 19 | 18 |
| 2020 | 24 | 24 |
| 2021 | 22 | 16 |
| 2022 | 14 | 9 |
| 2023 | 5 | 14 |
| 2024 | 13 | 16 |
| 2025 | 8 | 8 |
| 2026 | 6 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Photodetection device and method for manufacturing photodetection device14 Jul 2026US 12,684,887 B2Sumitomo Electric Industries, Ltd.
- Method of bonding column type deposits21 Apr 2026US 12,610,841 B2Protec Co., Ltd.
- Connecting pillar17 Sep 2026US 2026/0282992 A1Duksan Hi-Metal Co., Ltd.
- Bonding structures formed using selective surface treatment of copper bumps and methods of forming the same30 Apr 2026US 2026/0123452 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Chip package device26 Mar 2026US 2026/0090441 A1STMicroelectronics International N. V.
- Connector5 Feb 2026US 2026/0040983 A1STMicroelectronics (Grenoble 2) SAS
- Electronic structure including an interconnection film30 Oct 2025US 2025/0336868 A1
Most cited
By later US patents
- Article comprising vertically nano-interconnected circuit devices and method for making the same229US 6,340,822 B12002
- Apparatus and method for injection molding solder and applications thereof186US 5,244,143 AInternational Business Machines Corporation · 1993
- Methods for making z-axis electrical connections155US 6,260,264 B13M Innovative Properties Company · 2001
- Method of making and using lithographic contact springs151US 6,268,015 B1FormFactor, Inc. · 2001
- Article comprising vertically nano-interconnected circuit devices and method for making the same150US 6,383,923 B1Agere Systems Guardian Corp. · 2002