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US 2026/0090441 A1Published application
Chip package device
AssigneeSTMicroelectronics International N.V.
InventorsLudovic FALLOURD, Gregoire DELACOURT, Benjamin JOREZ
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Abstract
The present disclosure provides a chip package device. An example chip package device includes: at least one connection pad on a first surface of the chip; at least one pillar extending from, and in contact with, the pad; the pillar being formed in an alloy of a first element and of a second element, a melting temperature of the alloy being greater than a melting temperature of at least one of the first and second elements and greater than 260° C.
Claims20
A chip package device comprising:
- at least one connection pad on a first surface of a chip;
- at least one pillar extending from, and in contact with, the at least one connection pad;
- and
- wherein the at least one pillar being formed in an alloy of a first element and of a second element, a melting temperature of the alloy being greater than a melting temperature of at least one of the first element and the second element and greater than 260° C.
1 more element
A method of manufacturing a chip package device comprising:
- forming a chip of the chip package device, the chip having at least one connection pad on a first surface;
- forming at least one pillar extending from, and in contact with, the at least one connection pad, and formed in an alloy of a first element and of a second element;
- and
- wherein a melting temperature of the alloy being greater than a melting temperature of at least one of the first element and second element and greater than 260° C.
1 more element
Dependencies are inferred from the claim text.