Electronic device and manufacturing method thereof

A manufacturing method of an electronic device, comprising

• providing a substrate;
• forming a first metal layer on the substrate to transmit a ground signal;
• forming a first insulating layer on the first metal layer;
• patterning the first insulating layer to form at least one first opening;
• forming a second metal layer on the first insulating layer, wherein a first portion of the second metal layer is electrically connected to the first metal layer through the at least one first opening;
• forming a second insulating layer on the second metal layer;
• patterning the second insulating layer to form at least one second opening;
• forming a third metal layer in the at least one second opening, so that the third metal layer is electrically connected to the second metal layer;
• and
• disposing an electronic element on the second insulating layer, so that the electronic element is electrically connected to the second metal layer through the third metal layer and the at least one second opening,
• wherein in a top view direction, the at least one first opening is separated from the at least one second opening, the at least one first opening is disposed in a periphery of the electronic element, and the electronic element does not overlap with the at least one first opening.