Methods for making z-axis electrical connections
Assignee3M Innovative Properties Company
InventorsYu Chen, Joel A. Gerber, Peter B. Hogerton
Life of this patent
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Abstract
The present invention relates to a method for connecting an integrated circuit chip to a circuit substrate. The method includes the step of the steps pre-applying adhesive directly to a bumped side of integrated circuit chip. The method also includes the step of pressing the bumped side of the integrated circuit chip, which has previously been coated with adhesive, against the circuit substrate such that the bumps provide an electrical connection between the integrated circuit chip and the circuit substrate. The pre-applied adhesive on the chip forms a bond between the integrated circuit chip and the circuit substrate.
Claims11
A method for manufacturing integrated circuit chips comprising the steps of:
- providing a wafer including a bumped side having a plurality of conductive bumps;
- applying adhesive to the bumped side of the wafer such that the adhesive extends between the conductive bumps of the wafer;
- and
- dicing the wafer on which the adhesive has been applied into individual integrated circuit chips.
Dependencies are inferred from the claim text.