Connector

A method, comprising:

• forming a first number of first electrically-conductive pillars on a first contact on a surface of the substrate;
• forming a second number of second electrically-conductive pillars on a second contact on the surface of the substrate;
• forming a third number of third electrically-conductive pillars on a third contact on a contact surface of a die;
• forming a fourth number of fourth electrically-conductive pillars on a fourth contact on the contact surface of the die;
• coupling a lateral surface of the die transverse to the contact surface of the die to the surface of the substrate by an adhesive;
• forming a first electrically-conductive ball coupling the first number of the first electrically-conductive pillars to the third number of the third electrically-conductive pillars;
• and
• forming a second electrically-conductive ball coupling the second number of the second electrically-conductive pillars to the fourth number of the fourth electrically-conductive pillars.

A method, comprising:

• forming a first die including:
• a lower surface;
• an upper surface opposite to the lower surface and facing away from the lower surface;
• a first lateral surface transverse to the lower surface and the upper surface, the first lateral surface extending from the lower surface to the upper surface;
• a second lateral surface transverse to the lower surface and the upper surface, the second lateral surface is opposite to the first lateral surface and faces away from the first lateral surface, and the second lateral surface extending from the lower surface to the upper surface;
• a connection area at the upper surface, the connection area including a first contact at the upper surface;
• forming one or more first conductive pillars on the first contact of the first die that extend in a first direction;
• coupling the first lateral surface of the first die to a surface of a wafer with an adhesive at a region offset from a first contact at the surface of the wafer;
• forming one or more second conductive pillars on the first contact that extend in a second direction transverse to the second contact;
• and
• coupling the one or more first conductive pillars and the one or more second conductive pillars to each other by forming a first conductive ball coupling the one or more first conductive pillars to the one or more second conductive pillars.