Apparatus and method for injection molding solder and applications thereof

An apparatus for injection molding solder comprising:

• a reservoir for said molten solder;
• said reservoir having an output orifice;
• a mold having at least one cavity;
• said output orifice is in communication with said mold to permit said molten solder to be injected into said at least one cavity;
• means for applying pressure to force said molten solder into said cavities;
• said mold has a first and second surface and wherein said at least one cavity extend from said first to said second surface;
• an injection plate which is adapted to move with respect to said first surface of said mold, said injection plate comprising:
• a first injection plate side;
• a second injection plate side;
• an injection cavity opening to a first region of said second injection plate side;
• said injection cavity having an edge at said second injection plate side;
• and
• said output orifice of said reservoir being in fluid communication with said injection cavity.

An injection molding apparatus for disposing solder as mounds on a workpiece surface comprising:

• a reservoir for said solder;
• means for heating said solder to molten solder;
• said reservoir has an output orifice;
• a mold having a plurality of cavities in a predetermined array;
• said mold having a first substantially planar surface and a second substantially planar surface;
• said cavities extend from said first surface to said second surface;
• an injection plate adapted to move with respect to said first surface;
• means for applying pressure to said molten solder;
• means for controlling said pressure;
• said injection plate having a first injection plate surface, a second injection plate surface, an injection cavity having an edge at said second injection plate and a wiping cavity having an edge at said second injection plate side;
• said output orifice of said reservoir being in fluid communication with said injection cavity;
• means for moving said injection plate from a first location to a second location;
• at said first location said injection cavity is disposed over said array of cavities so that when pressure is applied by said means for applying pressure said molten solder is forced into said injection cavity and therefrom into said array of cavities;
• when said injection plate is moved from said first location to said second location, said wiping cavity wipes away excess molten solder at said first surface of said mold in the vicinity of said array;
• a workpiece holding means for holding said workpiece adjacent said second surface of said mold;
• and
• a means for heating said workpiece.

An apparatus for injection molding solder comprising:

• a molten solder reservoir means;
• a molding means;
• said molding means is in operative communication with said molten solder reservoir means;
• means for applying force to force said molten solder into said mold;
• and
• means for removing excess molten solder from said molding means.

An apparatus for injection molding molten solder comprising:

• a reservoir for said molten solder;
• said reservoir having an output orifice;
• a mold having at least one cavity;
• said output orifice is in communication with said mold to permit said molten solder to be injected into said at least one cavity;
• means for applying pressure to force said molten solder into said cavities;
• a plurality of said molds;
• a mold conveying means for transporting said plurality of said molds;
• a support substrate conveying means for transporting a plurality of support substrates;
• a workpiece conveying means for transporting a plurality of workpieces;
• said mold conveying means coacting with said support conveying means so that one of said supports coacts with one of said molds to provide a surface for injection molding molten solder into said one of said molds against said support to form a mold filled with solder;
• said mold conveying means coacting with said workpiece conveying means so that said mold filled with said solder is disposed against said workpiece and transferred thereto.

A method comprising:

• providing a mold having at least one cavity extending from a first surface to a second surface of said mold;
• disposing said cavity at said second surface adjacent to a surface of a workpiece;
• forcing molten solder into said cavity from said first surface of said mold;
• removing excess molten solder from said mold;
• removing said mold leaving a solidified solder mound on said surface.

An apparatus for injection molding of solder into a predefined geometry, which apparatus comprises:

• means to supply molten solder;
• a mold with plural cavities with predefined geometry;
• means to force said molten solder into said cavities;
• means for removing excess molten solder from said mold;
• and
• means to separate said solder within said cavities from said molten solder.

An apparatus for injection molding of solder into a predefined geometry, which apparatus comprises:

• means to supply molten solder;
• a mold with plural cavities with predefined geometry;
• means to force said molten solder into said cavities;
• means to separate said solder within said cavities from said molten solder;
• said cavities have interior surfaces which are not wettable by molten solder, said force means is pneumatic pressure applied to said molten solder, said separation means is means to wipe or shear away solder external to said cavity, further including means to convey said molten solder from said supply means to said mold cavities, means to freeze said solder within said cavities;
• wherein said means to convey is an injection plate adapted to flow molten solder from said supply to said mold cavities, said separation means provides relative motion between said mold and an adjacent member.

An apparatus for injection molding molten solder on a workpiece comprising:

• a mold having at least one cavity extending from a first surface to a second surface of said mold;
• said cavity at said second surface being disposed adjacent to a surface of said workpiece;
• means for forcing molten solder into said cavity from said first surface of said mold;
• means for removing excess molten solder from said mold;
• means for removing said mold leaving a solidified solder mound on said surface.