H10W 72/01215
Forming coatings
Official title: {forming coatings}
H10W72/01215 (Forming coatings) appears on 634 US grants and 680 published applications in this corpus.
Search patents in H10W- Granted patents
- 634
- Published applications
- 680
- Assignees
- 222
- Inventors
- 1,252
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 4 | 0 |
| 1998 | 6 | 0 |
| 1999 | 7 | 0 |
| 2000 | 12 | 0 |
| 2001 | 14 | 7 |
| 2002 | 15 | 22 |
| 2003 | 16 | 12 |
| 2004 | 16 | 8 |
| 2005 | 12 | 15 |
| 2006 | 9 | 10 |
| 2007 | 11 | 16 |
| 2008 | 7 | 19 |
| 2009 | 10 | 29 |
| 2010 | 20 | 25 |
| 2011 | 18 | 37 |
| 2012 | 13 | 36 |
| 2013 | 42 | 43 |
| 2014 | 34 | 56 |
| 2015 | 49 | 70 |
| 2016 | 65 | 51 |
| 2017 | 46 | 46 |
| 2018 | 34 | 17 |
| 2019 | 34 | 31 |
| 2020 | 24 | 29 |
| 2021 | 20 | 29 |
| 2022 | 30 | 24 |
| 2023 | 21 | 20 |
| 2024 | 14 | 12 |
| 2025 | 14 | 8 |
| 2026 | 2 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Ball grid array assembly using a solder paste mix and method of using a solder paste dip11 Aug 2026US 12,707,987 B1Frontgrade Technologies Inc.
- Semiconductor package12 May 2026US 12,628,668 B2Samsung Electronics Co., Ltd.
- Semiconductor package and manufacturing method of the same30 Dec 2025US 12,512,451 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Expanded head pillar for bump bonds23 Dec 2025US 12,506,097 B2Texas Instruments Incorporated
- Electronic device with improved electricial property2 Dec 2025US 12,489,046 B2Innolux Corporation
- Protective film forming method and chip manufacturing method24 Sep 2026US 2026/0293735 A1Disco Corporation
- Connecting pillar17 Sep 2026US 2026/0282992 A1Duksan Hi-Metal Co., Ltd.
- Semiconductor package3 Sep 2026US 2026/0262512 A1Samsung Electronics Co., Ltd.
- Temporary Chip Assembly, Display Panel, and Manufacturing Methods of Temporary Chip Assembly and Display Panel20 Aug 2026US 2026/0247771 A1Chongqing Konka Photoelectric Technology Research Institute Co., Ltd.
- Mounting structure and method for manufacturing same18 Jun 2026US 2026/0173980 A1Panasonic Intellectual Property Management Co., Ltd.
Most cited
By later US patents
- 3D packages and methods for forming the same418US 8,802,504 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Method of making microelectronic spring contact elements226US 6,184,053 B2FormFactor, Inc. · 2001
- Apparatus for forming a double-bump structure used for flip-chip mounting222US 5,508,561 ANEC Corporation · 1996
- Heat transfer structure for integrated circuit package195US 4,323,914 AInternational Business Machines Corporation · 1982
- Semiconductor device having columnar electrode and method of manufacturing same190US 6,476,503 B1Fujitsu Limited · 2002