Protective film forming method and chip manufacturing method
AssigneeDisco Corporation
InventorsAkihiro Hirata, Takumi Shingu, Sho Osawa, Senichi Ryo, Tomoaki Endo
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Abstract
Provided is a protective film forming method of forming a protective film on a target object, the method including holding a reverse side of the target object on a holding table such that a face side of the target object is exposed, and forming a protective film on the face side of the target object, in which the forming the protective film includes supplying a protective film agent in liquid form to the face side of the target object, rotating the holding table, and supplying gas to the face side of the target object.
Claims13
A protective film forming method of forming a protective film on a target object, comprising:
- holding a reverse side of the target object on a holding table such that a face side of the target object is exposed;
- and
- forming the protective film on the face side of the target object, wherein
- the forming the protective film includes supplying a protective film agent in liquid form to the face side of the target object, rotating the holding table, and supplying gas to the face side of the target object.
A chip manufacturing method of dividing a target object demarcated into a plurality of regions by projected dicing lines into a plurality of chips, comprising:
- holding a reverse side of the target object on a holding table such that a face side of the target object is exposed;
- forming a protective film on the face side of the target object;
- and
- dividing the target object into the plurality of chips by applying a laser beam from the face side of the target object to form laser processing grooves in the face side of the object along the projected dicing lines and exposing the laser processing grooves on the reverse side of the target object, wherein
- the forming the protective film includes supplying a protective film agent in liquid form to the face side of the target object, rotating the holding table, and supplying gas to the face side of the target object.
A chip manufacturing method of dividing a target object demarcated into a plurality of regions by projected dicing lines into a plurality of chips, comprising:
- holding a reverse side of the target object on a holding table such that a face side of the target object is exposed;
- forming a protective film on the face side of the target object;
- and
- dividing the target object into the plurality of chips by supplying plasma etching gas to the target object via the protective film after removing the protective film along the projected dicing lines, wherein
- the forming the protective film includes supplying a protective film agent in liquid form to the face side of the target object, rotating the holding table, and supplying gas to the face side of the target object.
Dependencies are inferred from the claim text.