Semiconductor package and manufacturing method of the same

A semiconductor package, comprising:

• a package having at least one semiconductor die;
• a redistribution circuit structure disposed on the package;
• a first electronic device module, mounted on a first mounting region of the redistribution circuit structure and electrically connected with the at least one semiconductor die through first connectors disposed between the redistribution circuit structure and the first electronic device module;
• a second electronic device module, mounted on a second mounting region of the redistribution circuit structure and disposed beside the first electronic device module, wherein the second electronic device module is electrically connected with the at least one semiconductor die through second connectors disposed between the redistribution circuit structure and the second electronic device module, the first mounting region and the second mounting region are adjacent and next to each other with a joining side;
• first insulating affixing blocks, disposed on the redistribution circuit structure and between the first electronic device module and the redistribution circuit structure, wherein the first insulating affixing blocks are separate blocks distributed along a periphery of the first mounting region, and the first insulating affixing blocks join the first electronic device module to the redistribution circuit structure;
• second insulating affixing blocks, disposed on the redistribution circuit structure and between the second electronic device module and the redistribution circuit structure, wherein the second insulating affixing blocks are separate blocks distributed along a periphery of the second mounting region, and the second insulating affixing blocks join the second electronic device module to the redistribution circuit structure;
• third insulating affixing blocks, disposed on the redistribution circuit structure and between the first and second electronic device modules and the redistribution circuit structure, wherein the third insulating affixing blocks are separate blocks distributed along the joining side, and the third insulating affixing blocks join the first and second electronic device modules to the redistribution circuit structure;
• and
• a fourth insulating affixing block disposed below the first electronic device module and between the first connectors, wherein the fourth insulating affixing block is spaced apart from the first connectors with a distance, and there is void space existing between the fourth insulating affixing block and the first connectors.

A method of manufacturing a semiconductor package, comprising:

• providing a bottom package including semiconductor dies encapsulated by an encapsulant;
• forming a redistribution circuit structure on the bottom package, wherein the redistribution circuit structure is electrically connected to the semiconductor dies;
• forming insulating blocks on the redistribution circuit structure;
• providing a first module with first connectors and a second module with second connectors;
• mounting the first module and the second module onto the insulating blocks over the redistribution circuit structure;
• performing a curing process to the insulating blocks to form insulating affixing blocks joining the first module and the second module to the redistribution circuit structure;
• and
• bonding the first module and the second module to the redistribution circuit structure by the first and second connectors,
• wherein bonding the first module and the second module to the redistribution circuit structure by the first and second connectors includes performing a first reflow process at a first temperature before performing the curing process and performing a second reflow process at a second temperature after performing the curing process, and the first temperature is lower than the second temperature.