Mounting structure and method for manufacturing same

Abstract

The mounting structure includes a first member including a first electrode pad and a metal bump disposed on a surface of the first electrode pad, and a second member disposed to face the first member and including a second electrode pad bonded to the metal bump, and a second insulating layer. An oxide film is formed on a surface of the metal bump. A metal bonding portion is formed between the metal bump and the second electrode pad, wherein at the metal bonding portion, metal constituting the metal bump and metal constituting the second electrode pad are metal-bonded. An oxide film bonding portion is formed between the oxide film and the second insulating layer, wherein at the oxide film bonding portion, the oxide film and the second insulating layer are bonded.

Dependencies are inferred from the claim text.