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US 12,489,046 B2Granted
Electronic device with improved electricial property
AssigneeInnolux Corporation
InventorsYi-Hung Lin, Chun-Hung Lai, Chun-Chin Fan
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Abstract
An electronic device and a method for manufacturing the same are provided. The electronic device includes: a first insulating layer; a first metal bump disposed on the first insulating layer; and a second insulating layer disposed on the first metal bump, wherein the second insulating layer includes a first opening exposing a portion of the first metal bump, wherein a thickness of the first insulating layer is greater than a thickness of the second insulating layer.
Claims17
An electronic device, comprising:
- a first insulating layer;
- a first metal bump disposed on the first insulating layer;
- a second insulating layer disposed on the first metal bump, wherein the second insulating layer comprises a first opening exposing a portion of the first metal bump;
- a third metal layer disposed under the first insulating layer;
- a second metal bump disposed on the third metal layer, wherein the second metal bump electrically connects to the first metal bump;
- a third insulating layer disposed on the second metal bump, wherein the third insulating layer comprises a second opening exposing a portion of the second metal bump;
- and
- a fourth insulating layer disposed on the third insulating layer, wherein a portion of the fourth insulating layer extends and is disposed in the second opening to contact the second metal bump,
- wherein a thickness of the first insulating layer is greater than a thickness of the second insulating layer,
- wherein the first metal bump is disposed between the first insulating layer and the second insulating layer.
7 more elements
A method for manufacturing an electronic device, comprising the following steps:
- providing a substrate;
- forming a third metal layer on the substrate;
- forming a second metal bump on the third metal layer;
- forming a third insulating layer on the second metal bump, wherein the third insulating layer comprises a second opening exposing a portion of the second metal bump;
- forming a fourth insulating layer on the third insulating layer, wherein a portion of the fourth insulating layer extends and is disposed in the second opening to contact the second metal bump;
- forming a first insulating layer on the substrate, wherein the third metal layer is disposed under the first insulating layer;
- forming a first metal bump on the first insulating layer, wherein the second metal bump electrically connects to the first metal bump;
- and
- forming a second insulating layer on the first metal bump, wherein the second insulating layer comprises a first opening exposing a portion of the first metal bump,
- wherein a thickness of the first insulating layer is greater than a thickness of the second insulating layer,
- wherein the first metal bump is disposed between the first insulating layer and the second insulating layer.
8 more elements
Dependencies are inferred from the claim text.